4-channel ASIC Tests - PowerPoint PPT Presentation

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4-channel ASIC Tests

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DC power vs biases, ring oscillator frequency, ADC ramp monitoring, token passing ... Regular 'expensive' bump bonding requiring an Under Bump Metallization ... – PowerPoint PPT presentation

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Title: 4-channel ASIC Tests


1
4-channel ASIC Tests
  • Michael Baumer, Jean-Francois Genat, Sam Meehan,
    Eric Oberla
  • August 26th 2009

2
DC, AC, Anodes tests (see also Erics document)
  • DC tests (Chicago)
  • - No s/w needed
  • - DC power vs biases, ring oscillator
    frequency, ADC ramp monitoring, token passing
  • AC tests (Hawaii)
  • - Chip on board (wire-bonding)
  • - DACs,
  • - FPGA,
  • - USB interface (in the FPGA),
  • - Fast pulser, (IEEE488 to PC)
  • - F/w and s/w load FPGA, program and trigger
    pulser, control DACs,
  • read digital data, manage results, (LabView
    ?)
  • Functional and parametric tests
  • - Sampling cell output vs input and sampling
    window
  • - Max sampling rate, analog bandwidth
  • - Leakages (voltage droop),
  • - Resolution

- Anodes/MCP tests (Chicago) - 4 chips (16
channels, 4)
- FPGA - DACs - USB - Test f/w
and s/w
1
3
DC test card
DC tests card
4
Detector tests with 4-channel ASIC
Goal Check the sampling ASIC with an actual
detector
5
Flip-Chip
  • - CVInc (TX) contacted
  • They can do it, not clear yet if
  • - Real cheap stud-bonding, or
  • Regular expensive bump bonding requiring an
    Under Bump Metallization
  • - Barcelona people will answer next week
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