SiLC R

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SiLC RD in EuropeLatest since LCWS04
Aurore Savoy-Navarro, LPNHE-Université de Paris 6
CNRS/IN2P3

• Main
  Topics
• Introductory remarks
• RD on sensors and test bench results
• RD on Mechanics
• Advances towards transparency
• Developing techniques to build long ladders
• Integration issues and simulations studies
• Concluding remarks

ALCPG Workshop, Victoria (British
Columbia),
July 28th to 31st, 2004
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Introductory remarksThe SiLC international
Collaboration (PRC-DESY May 03)
Helsinki U. (Fin) Obninsk St. U. (Ru) IEKP
Karlsruhe (Ge) Charles U. Prague (CZ) Ac.
Sciences.Wien (Au) LPNHE-Paris (F) U. de Genève
(CH) Torino U. (I) INFN-Pisa (I) La
Sapienza-Rome (I) CNM-Barcelona (Es) Cantabria U.
(Es) Valencia IFIC (Es)
Europe
BNL Wayne St.U. U. Of Michigan SLAC UCSanta
Cruz -SCIPP
USA
Korean Institutes Tokyo U. HAMAMATSU
Asia
The collaborative effort is developing (regular
audio/video confs). Collaboration between several
teams on various RD topics sensors,
electronics, tests, mechanics simulations.
Santander, Valencia and Hamamatsu
recently joined SiLC.
A. Savoy-Navarro, Victoria-LC, July 04
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RD sensors

• Main RD objectives
• Long microstrips (long ladders)
• Si Drift
• Keeping an eye on new Si-tech
  (pixelisation, VFE on detector etc)
• Main requests TRANSPARENCY, PRECISION
  BETTER YIELD
• increased
  wafers from 6 to possibly 12
• thinner and
  smaller pitch
• Expressed interest Hamamatsu (Now officially
  part of SiLC)
• ST
  Microelectronics/Catania (tbc)
• CNM-Barcelona as
  RD center
• Others ? New
  comers are welcome
• For Si-drift
  several European teams in STAR, ALICE
• have good
  connections with various firms (Canberra
• Lot of expertise from LEP, CDF, and now LHC
  (ATLAS, CMS and ALICE)
• Vienna responsible for coordinating the RD on
  sensors contacts with industry
• (also presently in charge in CMS).

A. Savoy-Navarro, Victoria-LC, July 04
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Sensor Test Quality set-up in HEPHY-Vienna
Semi-automatic sensor probe station for
quality Control system overview
Process control scheme Test structure
Test set-up for CMS Silicon tracking used for
tes- ting the sensors mounted on long ladder
prototypes for SiLC (similar set-up in Karlsruhe
another one fully automated in Pisa)
Self-made chuck and probe card support
A. Savoy-Navarro, Victoria-LC, July 04
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RD on sensors (contd)
QUALITY TESTS on SENSORS Ten new GLAST sensors
delivered by Hamamatsu for the construction of
the second long ladder prototype in Paris were
tested at the Test Quality Center (TQC) in HEPHY
Vienna (end of June 04)
Type S8743, chip size 8.950020 x 8.950020 µm,

thickness 410 10 µm
strip pitch 228 µm
number of strips
384
Total C sensor as f (reverse bias), measured
between backplane and bias line allows to
extract the V depletion of the sensor
to check its thickness
Total leakage current as f (reverse
bias), measured between backplane and bias line
Capacitance f(V)
Total leakage current f(V)
16 µA
3.5 pF
Capacitance (F)
Current (A)
0
0.5 pF
o
50
100
150
200
Voltage (V)
Voltage (V)
A. Savoy-Navarro, Victoria-LC, July 04
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Test Quality on sensors (contd)
Strip-by-strip tests are performed at a
constant bias voltage, and are aimed to
identify defective strips ( lt 1). All four tests
are performed in the same scan, by contacting DC
AC pads simultaneously and by
switching between different measurements.
Leakage current of each strip ? to identify
leaky noisy strips
I_diel measurement identify pinholes.
Polysilicon resistor connecting strips to the
bias line. The nominal value is required as well
as uniformity.
Coupling capacitor for each strip is measured to
check pinholes and monitor the uniformity of the
oxide layer.
Tests at TQC in HEPHY-Vienna gives the 10 sensors
are OK
A. Savoy-Navarro, Victoria-LC, July 04
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1) Detector design and fabrication
RD on sensors contd
CNM-Barcelona Centro Nacional de
Microelectronica offers interesting expertise's
that are of great interest for SiLC, in the
following topics

• Technologies
• P-on-N, N-on-P, N-on-N
• Pad, strip and pixels detectors
• High resistivity poly, capacitive coupling, two
  metal layers, two side processing
• Limited to 4 inches wafers
• Radiation hard devices Oxygenated FZ and
  magnetic Czochralski silicon (RD50)

A. Savoy-Navarro, Victoria-LC, July 04
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2) Device simulation
RD on sensors contd

• ISE-TCAD, TMA, Silvaco
• Technology simulation
• Electrical simulation
• Charge collection
• charge sharing in 3D

A. Savoy-Navarro, Victoria-LC, July 04
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3) Pitch adapter technology
RD on sensors contd

• Aluminum in glass
• Radiation hard
• Production for ATLAS forward Semiconductor Tracker

Fan-ins for ATLAS Forward Silicon Tracker
Pitch adapters are important in reducing material
budget in providing the best connection with
the electronics on detector
A. Savoy-Navarro, Victoria-LC, July 04
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4) Packaging Possibilities at CNM
RD on sensors contd

• Equipment
• Dek248 Screen printer
• ATV reflow oven with vacuum
• Manual PickPlace machine
• Datacon 2200 PPS for fine pitch

• Techniques
• SMD
• Wirebonding
• Flipchip
• Standard Temperatures
• High temperatures 280ºC

• Multichip Modules
• Standard pitch 400µm. Screen printing
• Fine pitch 50µm. Solder electroplating

Packaging plays an important role to help
reducing material budget (X0). Sensor, pitch
adapter, packaging, Electronics
Si-DETECTOR
A. Savoy-Navarro, Victoria-LC, July 04
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Long ladder read out by VA
R D on sensors test benches
LabView- based DAQ
Signal from LD1060nm
Faraday cage
14bits A/D
Electronic card Alims FPGA
Automated test bench in Paris
Motorized 3D-table ( 10 µ)
Most of the SiLC Institutes have well equipped
test benches key tool for detector
electronics RD
Consumer PC DB, monitoring programs
Bookkeeping
From remote user
A. Savoy-Navarro, Victoria-LC, July 04
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Preliminary results on the first long ladder
prototype
Built by Geneva U/ETH Zurich LPNHE-Paris
Average pedestal per strip
using AMS long ladder technique
Sensors are 4 , 300 µ thick, double-sided, 70
40.1 mm2, 110 µ/208µ readout pitch (p junction
side/n ohmic side). A set of strips are
connected in serpentine thus strips with
following length 28 cm, 56 cm, 112 cm and 224 cm
are tested. The long ladder is presently read
out with VA64_hdr chip, with 3.7 µs shaping
time. The ENC varies from 180 e- at C0 to 1010
e- for the longest strip (note this is with
3.7µs)
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Noise in mV
10
Shaping time 3.7 µs
4
2
0
50
100
150
200
250
300
350
Capacitance in pF
A. Savoy-Navarro, Victoria-LC, July 04
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L28cm
L56cm
1.146v
0.861v
L112cm
L224cm
0.771v
0.422v
In progress now varying shaping time up to 10
µs to improve results for strip length
above 1 m, and focalizing laser beam. Next
step calibration in MIPs S/N gt 10 is
achievable even for long strips
Signal from LD1060 on strips 28 cm long
A. Savoy-Navarro, Victoria-LC, July 04
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!! Fighting for slimness !!

• Work on the CAD mechanical design of the detector
  architecture structure
• Work on the cooling system Mechanical thermal
  studies
• Work on Electronics on detector (see talk on
  Electronics)
• !! Fighting for slimness !!

(See next section on Mechanics and talk
on Electronics)
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RD on Mechanics

• CAD design of the architecture of the various
  elements of the Silicon Envelop, but can be
  easily translated to the All-Silicon Tracking
  case
• Design and construction of the ladder prototype
• Thermal mechanical studies
• Alignment techniques are under development at U.
  of Michigan (FSI) and starting at U. of Cantabria
  (based on interferometer LHC expertise)
• Main RD aims
• Transparency, high precision,
  simplicity, and easy to build

A. Savoy-Navarro, Victoria-LC July 04
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Ex CAD design of for- ward tracker structure
Ex detailed CAD (CATIA) of the Si-FCH gives 4
XUV points, from X, UV, UV, UV, UV, X
plans Total width 127 mm
Details of the alveolar structure where false
double-sided UV plans are located
Similar alveolar CAD design achieved for the SET
and idem for the SIT Next step collaboration
with Industry to check feasibility /cost of
designed structure and
fabrication of a mechanical prototype for further
mechanical studies Needed inputs from full
simulation studies (occupancy) on long ladders
versus tiling with respect to the location of
the detector component.
A. Savoy-Navarro, Victoria-LC, July 04
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Long ladder construction 2nd prototype in
construction with GLAST sensors
Sensors are positioned one by one on assembly
frame
Gluing of the ladder
The long ladder structure is positioned on the 10
sensors with 4 locatings
Ready for bonding
A. Savoy-Navarro, Victoria-LC, July 04
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Thermal Mechanical Studies
2.5 m long drawer proto
Based on tests on a mechanical prototype
Long drawer made of 5 ladders
located in its alveolar
structure
At one end of the drawer cooling water ?
cooled air convection by wind turbine
conduction In the alveolar structure
Hypotheses of work External temperature
maintained at 35C. Power dissipation per
channel 400 µW and no power cycling taken into
account. The goal is to maintain the temperature
on the detector 30C, in order to avoid
intrinsic noise increase. Prototype results are
used to model the CAD thermal software (SAMCEF)
A. Savoy-Navarro, Victoria-LC, July 04
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Results obtained in function of time and with
water temperature cool down to 6.5C
encouraging!
Conduction convection by air cooling at 6.5C
at one end of the drawer, maintains the
temperature at 31.5C max even at the other end
(2 meter away)
A. Savoy-Navarro, Victoria-LC, July 04
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New thermal mechanical studies in Paris
Q (conv), F (surface of heat exchange in m2)
Calorific power from outside, F(system
temperature)
Q (convection), F (air flow in Kg/s)

• From previous studies 3 parameters
• must be taken into account to optimize
• the cooling system
• The calorific power Q (convection)
• The air flow must be optimised
• The surface of heat exchange must
• be increased

A. Savoy-Navarro, Victoria-LC, July 04
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New thermal prototype, built tocomply these
observations
Isolation
Thermal hermiticity
External T35o C
Higher air flow
Instrumented empty alveolas
New alveolar prototype
10x larger exchange surface heat
New prototype
A. Savoy-Navarro, Victoria-LC, July 04
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New thermal mechanical results
Note water temperature at 19C !
No need to cool down the water temperature, thus
simplified cooling system. Next step to design
and build a mechanical prototype of the C-fiber
structure and to design an overall integrated
cooling system
A. Savoy-Navarro, Victoria-LC, July 04
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Integration studies on Mechanical side
SET
Si-FCH

• In the case of a Large Detector (i.e. with
  TPC)
• Silicon-Envelope components are in strategic
  positions
• SIT links µvertex (s2-3µm) with TPC (s100µm)
• SET links TPC with calorimeter
• Similarly in the FW region FTD and Silicon
  -FCH.
• Questions to be answered
• In the case of SET Silicon-FCH especially
• One point? What precision?
• One segment?
• One track? (requested length of tracking level
  arm?)
• How this design compares with SiD in central
  FW?

SET
FTD
SIT
µvertex
A. Savoy-Navarro, Victoria-LC, July 04
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Integration issues the full simulation
essential tool
BRAHMS(G3) Full Simulation TESLA LC
V. Saveliev (Obninsk
U.)
TESLA geometry and Full Simulation of the h0 Z0 ?
b b m m-
A. Savoy-Navarro, Victoria-LC, July 04
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RERECO (G3) Reconstruction Display TESLA LC

Obninsk U.
External (SET) internal (SIT) Silicon tracking
layers
Event Display of Full Simulation of the h0 Z0 ? b
b m m and Particle Flow Objects
A. Savoy-Navarro, Victoria-LC, July 04
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Mokka(G4) Silicon Tracker Envelope (if TPC
central tracker)
Obninsk U.
Silicon Tracker Envelope for TESLA geometry in
Mokka (G4) Monte Carlo
A. Savoy-Navarro, Victoria-LC, July 04
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Future plans on simulation studies

• To pursue the full implementation
• of the SiLC tracking system within
• BRAHMS (G3) and GEANT 4
• frameworks, in the case of both
• The TPC as central tracker
• Inserting the detailed
• SIT FTD
• SET
• Si-FCH
• (this is well in progress)
• The All Silicon tracking
• And have the possibility to study
• all the related issues, performing
• comparisons and detailed studies.
• Collaboration is developing well

Fully G4 simulated H ? bb, Z ? e e- event
including SET (detector in white) (Obninsk
U.)
A. Savoy-Navarro, Victoria-LC, July 04
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Concluding remarks and prospects

• Lot of progresses made since this last spring.
• The collaborative effort is developing well, as a
  generic RD, studying BOTH a all-Silicon-tracking
  system (SiD) and a TPC Silicon tracking
  (GLC/TESLA/LD).
• New comers among which teams also contributing to
  the LHC Silicon trackers.
• They bring a unique expertise available
  facilities, essential to go ahead in developing
  the next generation of silicon tracking
  detectors, that are needed.
• SiLC NICE EXAMPLE of LHC x LC POSITIVE SYNERGY
• Getting slimmer (material budget) will be THE
  focus.
• New technologies are/will be
  helping.
• GEANT-based simulation inputs are now strongly
  and even desperately needed to go ahead.
  
• SiLC RD collaboration is really
  taking speed
• but a lot of work still
  ahead of us!!

A. Savoy-Navarro, Victoria-LC, July 04