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Review of exponential charging and discharging in RC Circuits

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Lecture 24 Today we will Review charging of output capacitance (origin of gate delay) Calculate output capacitance Discuss fan-out Discuss complementary nature ... – PowerPoint PPT presentation

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Title: Review of exponential charging and discharging in RC Circuits


1
Lecture 24
  • Today we will
  • Review charging of output capacitance (origin of
    gate delay)
  • Calculate output capacitance
  • Discuss fan-out
  • Discuss complementary nature of CMOS

2
ORIGIN OF GATE DELAY
When the inputs A and B change such that the
output F changes, the output cannot change
instantaneously the output capacitance must be
charged or discharged.
VDD
S
S
A
PMOS1
PMOS2
F
B
NMOS1
S
NMOS2
S
This is GATE DELAY.
3
REVIEW PULL-DOWN DEVICES
In our logic circuits, the NMOS transistors have
  • Gate terminal connected to VIN
  • Source terminal connected to ground directly, or
    through another NMOS

This means
  • When VIN is high, NMOS transistors are on.
    They help pull-down VOUT to ground, by conducting
    current to discharge the output capacitance.
  • When VIN is low, NMOS transistors are off.
    They act as open circuits from source to drain.

4
REVIEW PULL-UP DEVICES
In our logic circuits, the PMOS transistors have
  • Gate terminal connected to VIN
  • Source terminal connected to VDD directly, or
    through another PMOS

This means
  • When VIN is low, PMOS transistors are on. They
    help pull-up VOUT to VDD, by conducting current
    to charge the output capacitance.
  • When VIN is high, PMOS transistors are off.
    They act as open circuits from source to drain.

5
REVIEW MODEL FOR GATE DELAY ANALYSIS
There is a model for the behavior of transistors
in a CMOS logic circuit to analyze
charging/discharging of the output capacitance.
VIN 0 (for NMOS) VIN VDD (for PMOS)
VIN VDD (for NMOS) VIN 0 (for PMOS)
D
D
The resistance R is the effective resistance for
the device during the first half of the
transition. Each device can have different R!
G
G
R
R
S
S
6
REVIEW CALCULATING EFFECTIVE RESISTANCE
Consider pull-down, when VOUT must go from VDD to
0 V.
VDD
ID(N)
t0 ID(N) IDSAT(N)
RP
ttp ID(N) IDSAT(N)
VOUT
VDD
VDS(N)
VDD
VDD/2
We calculate RN by averaging the values of
VDS(N)/ID(N) at the beginning and ending of delay.
RN
RP -¾ VDD / IDSAT(P)
RN ¾ VDD / IDSAT(N)
7
CALCULATING OUTPUT CAPACITANCE
  • Two major sources of capacitance
  • The transistor gates in the next stage
  • The metal connection to the next stage

Both can be computed using the parallel plate
capacitor formula
A is the area of the plates, k is the dielectric
constant of the insulator in between the
plates, e0 is the permittivity of free space,
and d is the distance in between the plates.
since this is fixed by fabrication process.
We denote
8
CALCULATING OUTPUT CAPACITANCE
Each transistor gate terminal attached to the
output contributes a gate capacitance
where W and L are the channel dimensions and COX
is the capacitance of the gate per unit area
(parameters from ID vs. VDS).
Each metal connection at the output contributes a
capacitance also given by the parallel plate
capacitor formula, but with different length,
width, and capacitance per unit area.
9
EXAMPLE
VDD
VDD
S
S
S
VOUT1
VOUT2
VIN
S
S
S
Suppose that VIN was logic 1 for a long time, and
then switches to logic 0 at t 0. Find the
propagation delay through the inverter.
10
EXAMPLE
Use VDD 5 V VTH(N) -VTH(P) 1 V COX 5
fF/µm2 for both transistors L 2 µm for both
transistors W 2 µm for both transistors l 0
for both transistors µN 50000 mm2 / (V s) µP
25000 mm2 / (V s) WI 2 µm LI 200 µm COX(I)
0.1 fF/µm2
Calculate the effective resistance and total
output capacitance due to gate and interconnect
capacitance.
11
EXAMPLE
Since VIN is now low, VOUT1 must go from low to
high. Pull-up
VDD
RP
VDD
S
VOUT
VDD
VIN 0 V
S
RN
RP is the resistance involved in the charging.
12
EXAMPLE
RP - ¾ VDD / IDSAT(P) RP - ¾ (5 V) / (W/L mP
COX (VGS(P) VTH(P))2 ) RP - ¾ (5 V) /
(2mm/2mm 25000 mm2/Vs 5 fF/mm2 (-5 V -1V)2
) RP 1.875 kW Now calculate COUT There are
4 transistor gates attached to inverter output,
and one wire connecting the inverter output to
the NAND input. COUT 4 CG CI
13
EXAMPLE
CG W L COX (2 mm)(2 mm)(5 fF/mm2) 20 fF
CI WI LI COX(I) (2 mm)(200 mm)(0.1 fF/mm2)
40 fF
COUT 4 CG CI (4)20 fF 40 fF 100 fF
tP 0.69 RP COUT 0.69 (1.875 kW) (100 fF)
129 ps
14
FAN-OUT
Consider our previous example. Suppose that we
connected N NAND gates to the output of the
inverter. Each NAND gate adds 4 more gate
capacitances and another interconnect
capacitance. COUT N(4 CG CI) 100 N fF tp
129 N ps The fan-out, or number of logic gates
that can be attached to an output, is limited by
propagation delay considerations.
15
LOOKING AT CMOS CIRCUITS
One can often see the logical operation in a
CMOS circuit by looking at either the top or
bottom half of the circuit.
VDD
A
C
B
For example, looking at the top half of this
circuit, we see that the output will be connected
to VDD (F is high) when (B OR C is low) AND A
is low F (B C) A
F
B
A
C
16
LOOKING AT CMOS CIRCUITS
The bottom half of the circuit always results in
the same equation as the top half, just rewritten
via DeMorgan (thats why output is always
defined).
VDD
A
Looking at the bottom half of this circuit, we
see that the output will be connected to ground
(F is low) when (B AND C are high) OR A is
high F B C A F B C A
C
B
F
B
A
C
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