Material Library Used in this FEA

1
Material Library Used in this FEA
All materials were assumed to be isotropic with
constant properties except - TPG in which the
thermal conductivity varies - Anisotropic
carbon fiber facing and bump bonds
TPG Thermal K
Temp in K
K in W/m-K
Carbon fiber 0/90facing Einplane 1.48e5 Mpa,
Eout-of-plane 7445 Mpa, kinplane 55.85 W/mK,
kout-of-plane 0.69 W/mK, ainplane -0.04e-6
ppm/K, aout-of-plane 30.17e-6 ppm/K Eutectic
solder bump bond layer Ex Ez 0.15 Mpa, Ey
1500 Mpa, kx kz 0.33e-3 W/mK, ky 2.38 W/mK,
a 24.7e-6 ppm/K
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RESULTS WITH CF/TPG/CF SUBSTRATE 0.6 mm
(0.120.380.12) mm COOLING AT ENDS
Overall ?T 22C From 7C to 29C
Heat Load 2.28W , Half Model with 4 chips
?T, substrate 12.8C From 7C to 19.8C
?T, HDI 14.6C From 12.2C to 26.8C
?T, sensor/ROC 2.9C From 26.1C to 29C
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RESULTS WITH CF/TPG/CF SUBSTRATE 0.6 mm
(0.120.380.12) mm COOLING AT ENDS
Heat Load 2.28W , Half Model with 4 chips
Max resultant displacement 2 microns
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RESULTS WITH CF/TPG/CF SUBSTRATE 0.6 mm
(0.120.380.12) mm COOLING AT ENDS
Heat Load 2.28W , Half Model with 4 chips
TPG Layer Max Resultant Stress 1.25 Mpa Max
Stress_Z 0.13 Mpa Flexural Strenth 36.7 Mpa
Z 38.5 Mpa // Tensile Strength lt 0.69
Mpa Z 6,897 Mpa //

Stress Z Plot (out-of-plane direction)
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RESULTS WITH CF/TPG/CF SUBSTRATE 0.6 mm
(0.120.380.12) mm COOLING AT ENDS
Heat Load 2.28W , Half Model with 4 chips
Stress Resultant Plot
Stress Z Plot (out-of-plane 900direction)
Carbon Fiber Layer Max Resultant Stress_X 0.1
Mpa Max Stress_Z 0.9 Mpa Flexural Strenth
669 Mpa 00 Tensile Strength 1950 Mpa
00 28 Mpa 900