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Dielectric Properties of Ceramic Thin Films

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Title: Dielectric Properties of Ceramic Thin Films


1
Dielectric Properties of Ceramic Thin Films
  • Mara Howell
  • Materials Science and Engineering
  • Junior, Purdue University
  • Professor Kvam, Research Advisor

2
Presentation Outline
  • Background
  • Project Goals
  • Experimental Procedure
  • Tests
  • Results
  • Future Work

3
Background Capacitors
  • Q CV
  • Dielectric materials increase the amount of
    stored charge
  • Enhanced capacitance is related to original
    capacitance by the dielectric constant, ?
  • A material with a higher ? will hold more charge

4
Background Barium Titanate
  • Titanium ion is slightly displaced at room temp.
    (spontaneous polarization)
  • Dielectric constant is dependent on dipole moment
    and magnitude of movement

5
Background Ferroelectrics
  • Barium Titanate exhibits typical characteristics
  • Tetragonal structure
  • Movement of central atom
  • Randomly oriented domains result in neutral net
    charge
  • Applied voltage shifts domains

6
Project Goals
  • Create Barium Titanate thin films using a Sol-Gel
    processing method
  • Refine the Sol-Gel process
  • Analyze Barium Titanate thin films
  • Modify the process and analyze the resulting
    films
  • Dopants
  • Varying annealing temperatures

7
Experimental Procedure Film Deposition
  • Bottom electrode created by sputtering Pt.
  • Sol-Gel process used to create Barium Titanate
    thin films
  • Stochiometric amounts of Barium hydroxide, acetic
    acid, ethylene glycol, 1-butanol and
    titanium-4-butoxide
  • Spin coating
  • Low temperature annealing
  • Repeat for thicker films
  • High temperature annealing at 850C

8
Experimental Procedure Top Electrode
9
Silicon substrate vs. Glass substrate
  • Glass substrates used initially
  • Inexpensive, accessible
  • Warping of the substrate prevented successful
    deposition of top electrode
  • Warping of substrate caused the film to crack
  • Low melting temperature prevented completion of
    high temperature anneal
  • Silicon substrates solved these problems

10
Tests Performed
  • XRD analysis
  • Optical Microscopy
  • Polarization hysteresis
  • Capacitance vs. Voltage (CV)
  • Current vs. Voltage (IV)
  • AFM images

11
XRD Analysis
12
Optical Microscopy Sample Characteristics
200 µm
100 µm
500 µm
200 µm
13
Optical Microscopy Top Electrode
500 µm
14
Optical Microscopy Porosity
100 µm
200 µm
15
Electrical Properties
  • Properties tested using microprobe system
  • LabView programs written by Mark McCormick
  • Samples with known characteristics were tested

16
Accuracy
17
Ferroelectric Sample
18
Barium Titanate Sample
Fig. 2 Published CV plot ( N.V. Giridharan, R.
Jayavel, P. Ramasamy)
Fig. 1 Measured Capacitance vs. Voltage for
sample 8
19
Dielectric Constant
  • C is measured at the top point of the curve
  • d is estimated to be 400 nm
  • A is calculated from optical microscopy
  • Average of tested samples is 160

20
Voltage vs. CurrentBreakdown Voltage
21
Atomic Force Microscopy
Average grain size 0.16 microns
22
Atomic Force Microscopy
23
Conclusions
  • Replacing glass substrate with silicon improves
    quality
  • 100 concentration for first layer
  • Annealing at higher temperature leads to better
    quality
  • Breakdown voltage appears to be 40V

24
Future Work
  • Examine the relationship between processing and
    grain growth
  • Examine the relationship between grain size and
    the dielectric constant
  • Examine the effects of dopants on the electrical
    properties of the material

25
Acknowledgments
  • Thomas Key
  • Jacob Jones
  • NSF REU grant DMR-0243830

26
Questions??
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