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2002 VLSI Symposium

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4. Ultra-low power LSI design for Future Mobile Communications. Speaker: T. Douseki (NTT) ... Advanced Memory Technology T. Nakamura. Advanced Interconnect ... – PowerPoint PPT presentation

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Title: 2002 VLSI Symposium


1
2002 VLSI Symposium
  • Executive Committee Meeting
  • 2/5/02

2
Review of 2001 Circuits Symposium
Submitted
Accepted
3
Preview of 2002 Symposium
  • Final Paper Selection Meetings upcoming
  • 2002 Circuits
  • 226 Submissions (193 in 2000)
  • 84 Technical sessions
  • 2002 Technology
  • 231 Submissions (260 in 2000)
  • 84 Technical sessions

4
NAE Technical Program Committee
  • 25 turnover from the last committee
  • Total 22 committee members
  • 2 from Canada, 2 from Europe
  • 27 from Universities
  • TPC expertise

5
Invited papers - Circuits
  • 1. On-chip Interconnect - Where is it going?
  • Speaker J. Meindl
  • Trends in interconnects, past and future,
  • high performance and low power
  • Impact on SOC, SOP
  • 2. Biomedical Implantable Electronics
  • Speaker K. Wise (Univ or Michigan)
  • Talk will cover history, state of the art, and
    the view as to where it will go in the future.
  • 3. Digital Still Camera Technology
  • Spekaer H. Tamayama (Fuji Photo Film)
  • 4. Ultra-low power LSI design for Future Mobile
    Communications
  • Speaker T. Douseki (NTT)

6
Invited papers - Technology
NAE MOSFET scalability limits and new frontier
devices." Dimitri Antoniadis,
MIT JFE MEMS Tech. for optical, medical and
SOC applications M. Esashi, Tohoku
University (not yet confirmed)
7
Rump Sessions - Circuits
  • Scaling limit in a power limited environment,
    Architecture vs. Circuit design
  • JFE Prof. Tadahiro Kuroda (Keio Univ.)
  • NAE Prof. Ken Yang (UCLA)
  • Designing high-performance analog in deep
    sub-micron CMOS
  • JFE Dr. Tatsuji Matsuura (Hitachi)
  • NAE Dr. Katsu Nakamura (Analog Devices)
  • Revolution or evolution for memory technology?
  • JFE Dr. Changhyun Kim (Samsung)
  • NAE Dr. Hugh MaAdams (TI)
  • System on a Chip OR System in a Package?
  • JFE Circuits T. Sakurai(University of Tokyo)
  • NAE Circuits J. Goodman (Lumic Electronics)

8
Rump Sessions - Technology
  • 1 - Device Limits- Potential for novel
    devices
  • 2 - Next Generation Memory
  • 3 - Future Lithography roadmap
  • Organizers C. Dennison and T. Eimori
  • J - System on a Chip OR System in a Package?
  • JFE Circuits T. Sakurai(University of Tokyo)
  • NAE Circuits J. Goodman (Lumic Electronics)

9
Short Course - Circuits
  • Organizers Dr Stephen Kosonocky (NAE), Dr.
    Koichiro Ishibashi, STARC (JFE)
  • Title Leakage Power Reduction Techniques for
    Digital Circuits
  • (Tentative topics and speakers)
  • 1. Technology overviewHow leakage components
    will scale David Frank (IBM)
  • 2. Techniques for variable well bias
    Hitachi?
  • 3. Methods for Power Supply decoupling
    Hitachi/Toshiba?
  • 4. Leakage sensitive logic families
    Intel?
  • 5. TBD
  • 6. TBD

10
Short Course - Technology
  • Organizers C.S. Pai and H. Ishiuchi-san
  • Title Key Technology Challenges for sub-70nm
    VLSI
  • (Tentative topics and speakers)
  • Advanced Device Technologies H. Iwai
  • Novel Device Technologies P. Wong
  • Advanced Memory Technology T. Nakamura
  • Advanced Interconnect Technologies K. Maex

11
2002 Financials
  • Budget assumes 19 decline from 2000 (tracking
    ISSCC)
  • Eliminated all expenses possible
  • Without impacting conference quality
  • Will add items back in if attendance continues to
    improve
  • Budget Surplus 8 for both Technology and
    Circuits
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