DELILA

1

• DELILA
• Development of Lithography Technology for
  Nanoscale Structuring of Materials Using Laser
  Beam Interference

1. PROJECT INFORMATION

• 2. AIM OBJECTIVES
• Aim
• Development and application of multiple beam
  interference lithography technology for nanoscale
  2D and 3D structuring of materials in nano
  photonics, electronics and fabrication.
• Objectives
• Assessment and specification of DELILA
  application targets.
• Fundamental exploration of multiple beam
  interference lithography and its capabilities.
• Development of computer software for the
  analysis of interference of several coherent
  beams of laser radiation and for the calculation
  of the results of diffraction of the radiation by
  
• periodic structures of different forms.
• Development of the interference lithography
  technology using the complete cycle of
  lithography and exposition of a photo-resist by
  the radiation of a high-power UV laser.
• Investigation of conditions for manufacturing
  nanoscale periodic defects in semiconductor
  crystals.
• Modification of different materials by using UV
  radiation.
• Development of DELILA system.

3. CONSORTIUM MEC - Manufacturing Engineering
Centre, Cardiff University, UK (Coordinator).
  ORC - Optoelectronics Research Centre, Tamper
University of Technology, Finland.   SILIOS -
SILIOS Technologies SA, France.   IAP - Institute
of Applied Physics, Russian Academy of Sciences,
Russia.   CEIT - Department of Microelectronics,
Centro de Estudios e Investigaciones Técnicas de
Gipuzkoa, Spain.