Title: Electronic Cooling Solutions Inc.
1(No Transcript)
2Electronic Cooling Solutions Inc.
- Thermal management consulting company
- Located in the heart of Silicon Valley
- Provide solutions for thermal design problems
- Use of experience, modeling experimental
methods in the design process - Clients include over 60 companies
3Outline
- Introduction
- Need for Innovative Cooling Solutions
- Objective
- Scope of this Presentation
- Cooling Solutions Air-based Cooling Systems
- Water-based Cooling Systems
- Refrigerant-based Cooling Systems
- Comparative Analysis
- Conclusion
- Vendor Contacts
4Introduction - Power Density and Heat Load Trends
- Electrical Power Waste Heat
- Increase in power densities from the CPU-level
to the System-level
System-level
Rack-level
Board-level
Component level
Room-level
- Current power density at the rack level 1 to
3 kilowatts - (up to 30 kilowatts per rack in two to four
years - Hannemann and Chu 07)
5Need for Innovative Cooling Solutions at
Rack-Level
- Datacenter TCO is characterized on a per rack
basis - Addition of newer and higher powered equipment in
existing datacenters - Hotspots in datacenter resulting from
high-density servers - Hotspots resulting from unavailability of cooling
air from CRAC units - Design shortcomings within the rack result in
inefficient cooling
6Objective
- Cooling of equipment in rack using airflow and
impact of minor design changes for better cooling
- Cooling of high density equipment using
water-based cooling techniques - Cooling of high density equipment using
refrigeration-based cooling techniques - Provide vendor data for the above mentioned
products
7Scope of this Presentation
- Limited to discussion of cooling solutions only
at the rack level - Closed racks and commercially available products
- Discussion on Component-level, Board-level and
Room-level cooling can be personally consulted
8Airflow-based Cooling Techniques
9Cooling of Racks with Conditioned Air
- Most easy to implement and maintain
- Limitation based on cooling capacity, acoustics
and power consumption - Detailed analysis could improve efficiency of air
cooling
Application of Computational Fluid Dynamics (CFD)
- Pressure drops and airflow patterns
- Determine by-pass air
- Determine areas of re-circulation
- Determine failure modes of cabinet fans
- Requires testing to develop confidence in models
10Cooling of Racks with Conditioned Air
- Airflow Enhancement in Racks
- Based on CFD Analysis
- Sample case study 1
- Sample case study 2
- Cabinet powered fans airflow layouts
- Best practices
- Airflow enhancing products
11Sample Case Study 1
- Study done by Electronic Cooling Solutions Inc.,
- 42U Cabinet fitted with twenty one 2U units
- 15.75 kilowatts per rack
- Inlet temperature of 40 deg C
- Airflow 1932 CFM
- 10,000 ft Altitude Conditions
- Simplified cabinet shown here
- Objective was to optimize the cabinet for better
cooling/use of higher powered equipment
12Sample Case Study 1 (Contd )
Higher temperatures at the inlet sides
Inlet Temperature
Re-circulation of Flow
13Sample Case Study 1 (Contd )
Open space between the rack rails and cabinet
sides
Vertical blockages between the rack rails and
cabinet sides
14Sample Case Study 1 (Contd )
- Added blockage above the topmost unit of the rack
Top of 2U server
Area above the topmost 2U rack is blocked
Top of rack cover meant for passing cables from
front to rear
15Sample Case Study 1 (Contd )
16Sample Case Study 1 (Contd )
No blockages
Blocked passages
17Sample Case Study 1 (Contd )
- Current study shows 17 to 25 increase in power
dissipation based on exhaust temperature. - By blocking re-circulating flow, it is possible
to use higher powered equipment in the rack. - Blocking can be done by employing Brush Strips.
- Avoid using larger racks with rails set to lower
rack width settings (Using 23 rack with rails
set to hold 19 equipment)
18Sample Case Study 2
Container wall
- Study done by Electronic Cooling Solutions Inc.,
- Racks placed in containers
- Create airflow model of blowers
- Evaluate alternate designs for blower module
Heat Exchanger
2U Servers
2U Servers
Blower Module
Rack Model
Symmetry Walls
19Sample Case Study 2
Testing
Module 1 860 CFM
Module 2 1024 CFM
- Apprx 20 increase in airflow with the
re-designed baffles and perforated casing
Testing to collect data for modeling
20Cooling of Racks with Conditioned Air
- Airflow Enhancement in Racks
- Based on CFD Analysis
- Sample case study 1
- Sample case study 2
- Cabinet powered fans airflow layouts
- Best practices
- Airflow enhancing products
21Airflow Enhancers Cabinet Powered Fans
Front or Footprint Inlet
Supply Air
Raised Floor
Front In Rear Out
22Airflow Enhancers (Cabinet Best Practices)
Raised Floor
Supply Air
23Airflow Enhancers (Cabinet Best Practices
(Contd))
Dropped Ceiling
Dropped Ceiling
Raised Floor
Raised Floor
Supply Air
Supply Air
24Airflow Enhancing Products
- APC 2U Rack Air Distribution
- Delivers air directly from the raised floor into
the rack inlet - Minimizes top-bottom inlet temperature
distribution - Allows rack loads up to 3.5 kilowatts per rack
Bottom-Top Rack Air Distribution Unit
Side Rack Air Distribution Unit
Roof Air Removal Unit
Application View
Images APC (www.apc.com)
25Airflow Enhancing Products (Contd)
Rittal Side Breathing Air Baffle System
Rittal Enclosure Blower
Images Rittal (www.rittal-corp.com)
- Higher density rear door rack air removal unit
- Allows rack loads up to 16.5 kilowatts /14
kilowatts per rack - Challenges in obtaining flow through tiles in the
datacenter
Liebert XDA
APC
Images www.apc.com and www.liebert.com
26Water-based Cooling Techniques
27Water-based Cooling
- Basis QLOAD mCp DT rVCp DT
- (Water has 3000 times higher heat carrying
capacity than air) - Chilled water from building supply
- Cooling high density servers up to 70 kilowatts
per rack - Lower energy cost as some of the CRAC units can
be removed - Avoid hotspots due to high power-density
equipment - Possible to have redundant systems (Chillers,
pumps, piping, and power supply) to avoid
downtime - Importance of CDU
- Electrically conductive, corrosiveness and high
flow rates
28Water-based Cooling
Pure Water-based Cooling
Combination of Air and Water Cooling
Heat Exchanger
Heat Exchanger
Raised Floor
Raised Floor
29Water-based Cooling
- Cooling system design by Naissus Thermal
Management Solutions - Heat removal of 20 kilowatts
- Closed liquid loop with bottom mounted fin and
tube heat exchanger - Thermal test done with 5 blade servers
Water from Chiller
Water sent to Chiller
30Water-based Cooling
Temperature Distribution inside the Rack
31Water-based Cooling
- Cooling system design by Vette Corp.
- Heat removal of up to 30 kilowatts
- Rear door closed loop liquid heat exchanger
designed by IBM - Currently available only for IBM Enterprise Rack
- Available from Rittal for retro-fit designs
IBM Rear Door Heat Exchanger
Images www.vette-corp.com
Pressure drop across the heat exchanger for a
typical 1U fan setup
32Water-based Cooling
- Cooling system design by APC.
- Heat removal of up to 70 kilowatts
- Controlled in-row cooling
- Row air containment
- Modularity
- Similar designs from HP (35 kilowatts)
- Similar concepts available from Rittal (30
kilowatts) - Similar concepts available from Liebert (8
kilowatts and 17 kilowatts)
Front View
Rear View
Heat Exchanger and Fan Assembly
Images www.apc.com
33Refrigerant-based Cooling Techniques
34Refrigerant-based Cooling
- Phase change (latent heat transfer)
- Electronics-safe
- Low flow rates and non-corrosive
- Some systems are stand-alone and hence flexible
- CRAC units are the most common ones
- Chilled water from building supply may be used
for supplemental cooling - Expensive ( comparable to water additives)
35Refrigerant-based Cooling
- Cooling system design by Liebert
- XDF- Cooling capacity of 14 kilowatts
- Stand-alone unit
Liebert XDF Self Contained Unit
Images www.liebert.com
36Refrigerant-based Cooling
- Cooling system design by APC.
- Heat removal of up to 43 kilowatts
- Modularity
- Rack air containment
APC In-Row Cooling
37Refrigerant-based Cooling
- Cooling system design by Liebert
- XDV- Rack mount air conditioners (10 kilowatts) -
Almost no floor space required - XDH-Rack Cooling capacity up to 30 kilowatts
- Also available from Rittal
Liebert Roof Mount Cooling
Liebert In-Row Cooling
Rittal Rear Door Hx
Images www.liebert.com
38Liquid Based Touch Cooling
39Water/Refrigerant-based Touch Cooling
- Direct contact cooling combined with chip cooling
- Remove heat at the source
- Available from
- Clustered Systems
- Rittal (Power electronics)
- SprayCool (20 to 30KW)
Cold plate with Liquid Cooling
Liquid Cooling of Boards
Images www.rittal-corp.com
Images www.ibm.com
Spray Cooling
Images www.spraycool.com
40Refrigerant-based Touch Cooling
- Cooling system design by Thermal Form and
Function - Pumped liquid multiphase cooling
- Heat removal of up to 10 kilowatts
- per evaporator (Modular)
- Designed for retro-fit applications
- Air/Water cooled condenser unit can be used
Thermal Form and Function Refrigeration Unit
Images http//www.thermalformandfunction.com/
Two Phase Flow
41Comparison of Cooling Techniques
42Comparative Analysis
- Study by Hannemann and Chu Interpack 07
- Comparative study of cooling technologies with a
model datacenter
Capital Expenditure of Cooling Equipment
Area required for Cooling Equipment
Power Consumption of Cooling Equipment
43Conclusion
- Reviewed innovative and commercially available
technologies for cooling racks - Discussed design approaches with use of CFD to
maximize performance of air cooling - Reviewed products and techniques for enhancing
airflow within a rack - Reviewed cooling of high density equipment using
chilled water and refrigerant - Selection of cooling strategy will depend on the
specific requirements of the client
44Vendor Contacts
- APC Morrison, Harold Wells Associates
(925-355-9900) - Rittal Sales (800-477-4000)
- Liebert Frank Stone (925-734-8660)
- Spray Cool Sales (866-993-2665)
- Clustered Systems Phil Hughes (415-613-9264)
- Trox AITCS - Thomas Hudgens (347-325-4347)
- Thermal Form and Function Joe Marsala
(978-526-9672) - Vette Corp - Skye Emerson (508-203-4694)
- Naissus Thermal Management Solutions - Mirko
Stevanovic (416-892-4071)
45References
- Product websites and communication with vendors
- Hannemann, R and Chu, H., (2007), Analysis of
Alternative Data Center Cooling Approaches, ASME
Interpack 1176, Vancouver, BC.
46Acknowledgement
- Speck Design
- Our colleagues at Electronic Cooling Solutions
- Khyati Varma
- Ceferino Sanchez
- Adriana Romero
- Sridevi Iyengar
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