Physics Division Plans

1
Physics Division Plans

• Engineering Division - Mechanical
• Retreat
• June 26, 2001

2
Overview

• Attempt to cover this decade
• ATLAS
• BaBar
• SNAP
• Linear Collider
• Other
• Caveats
• Not a complete look at all Phys. Div. Activities
• Uncertainties grow with time
• Talk reflects my opinions

3
ATLAS(1)

• Now - 2006
• Lead role in mechanical structure for ATLAS pixel
  project
• Deliverables requiring composite structures and
  close electrical/mechanical integration built at
  LBNL or under contract to LBNL.
• Fabrication in Bldg. 77s, including(I hope) final
  assembly/test in new clean room in 77.
• CERN final assembly and installation
• ATLAS pixel upgrades(after initial running)
• Pixel system will be upgraded.
• Lower mass in structures/services is one of the
  goals. This requires development, starting(if
  possible) even before first collisions(eg in 2004
  onwards) and should continue as long as there are
  good ideas.
• Production could even start before first
  collisions in 2006 if ideas are compelling. Need
  to be ready by 2008/2009.
• LBNL can be leader in this area(if we dont get
  worn out building first detector).

4
ATLAS(2)

• Major ATLAS upgrades
• LHC luminosity upgrade in long-range plan.
• LHC luminosity above 1034 requires both new ideas
  and replacement of entire ATLAS tracking system.
• Very likely this would mean expansion of pixel
  system to larger radii - bigger system - and new
  and larger silicon strip system.
• This would be very large effort(some hundreds of
  M)
• Timescale obviously depends on LHC operation,
  physicsbut installation by 2014 is a reasonable
  guess. Would require about 5 year
  development/production time, preceded by
  RD(above 1034 is hard).

5
ATLAS Pixel Detector
6
(No Transcript)
7
ATLAS -gt ME

• Design and FE modeling of composite structures
• Fabrication of composite structures
• Design validation for ultra-stable structures.
  Acquisition of TV holography system a significant
  step in improving LBNL capability. Should expand
  on this area(environmental chamber, coincident IR
  thermography, improved computing power,)
• Optical and touch CMM will continue to be needed.
• Electrical/mechanical integration. This should
  mean joint modeling of electrical and mechanical
  properties(not currently done in any systematic
  way). This also includes the subject of cable
  design and modeling, custom design and sometimes
  fabrication of low mass cables.
• Clean room space and fabrication equipment(wire
  bonders, plasma cleaning, glue robots, .)
• Innovations in stable, low mass structures and
  power, signal and cooling integration will be key
  to future involvement.

8
BaBar(1)

• Middle 2002
• Remove the SVT so PEPII can have access to the
  beam pipe for modifications. Only moderate rework
  of the SVT.
• Need from engineering mechanical technician and
  electrical coordinator help.
• Electrical coordinator a few man months from now
  to June 2002. Full time for one man month June
  2002.
• Mechanical technician 20 now to Jan 2002. Full
  time Jan to Aug. 2002.
• Middle 2004
• Remove the SVT bring to LBNL for refurbishing.
  Manpower similar to above with the addition of
  two full time mechanical technicians for three
  months during the rework at LBNL
• In addition need to share the clean room in
  77(assuming it exists).
• (Note may not have Fred Goozen at this time as he
  may retire.)

9
BaBar(2)

• 2005
• BaBar and PEPII upgrade path not entirely clear
  but increased luminosity will be key gt replace
  SVT(radiation damage)
• LBNL would be natural location for design,
  fabrication, integration as before - lead role
• Need both design and technical support. Composite
  structures, electrical/mechanical integration,..
• Even later - new machine(1036)?
• Silicon based detectors - larger scale, new
  techniques.
• Starts to look like hadron collider, but low mass
  structure even more important.

10
BaBar -gt ME

• Immediate(and critical) need over next few years
  is for technical support familiar with silicon
  systems or to become rapidly familiar with
  silicon systems.
• If warranted by physics need, by mid-decade,
  LBNL would be natural site to lead replacement of
  SVT. This would require design, fabrication
  facilities, technical support.at least similar,
  probably larger, scale to existing SVT.

11
SNAP(1)

• SNAP and related instrumentation
• CCD instrumentation, packaging and use
• SNAP project development
• Active projects
• Package development for backside illumination
• Molybdenum fabrication
• Alignment mechanism
• Glue/epoxy research
• Glue/epoxy application techniques
• SNAP-specific implementation of LBNL chicken
  feeder dewar
• Package existing devices to deliver to NOAO,
  SNIFS, ESI, .
• 3D conceptual modeling

12
SNAP(2)

• Near term projects
• Mechanical/thermal model of assemblies
• Measure material properties to feed model
• Performance measurements of prototypes to
  validate model
• Scale up the model to the full detector
• Incorporate test dewars into optical test system
• Build small focal plane containing 4 to 8 CCDs to
  use in a ground-based telescope.
• 3D conceptual modeling

13
SNAP(3)

• Longer term
• Mass production
• CCD assembly parts
• CCD mechanical assembly
• Cryostats for mass production of CCDs
• Focal plane
• Base plate design and fabrication - no longer a
  flat plate, rather, it is highly faceted.
• Probable that we will have to design the shutter
  mechanism.
• Focal plane base plate attachment to passive
  cooling radiator
• Particle/thermal/light shield cone design.
• Mounting system for focal plane and shield
• Modeling of thermal/mechanical performance
• Integration and testing
• Test chamber (150 K)
• Mechanical survey of CCDs.
• Operational testing of entire CCD array.
• NB, integration of instruments with spacecraft is
  scheduled for mid-07

14
3D conceptual modeling
15
GigaCam Assembly
Particle/thermal/light shield
CCDs
Support plate
Heat Radiator
Base plates
16
Mosaic Packaging
Plug and play Precision CCD modules, precision
baseplate, and adequate clearances designed
in. Focal plane tolerance is ?25 ?m. Final
assembly can be xyz surveyed cold.
Recent development, focal plane will now be
curved requiring a faceted base plate.
Cable
150 K plate attached to space radiator.
17
CCD Packaging
Prototypes are being assembled with dummy silicon
that includes all steps including wire
bonding. Want to deliver functional packages to
telescopes by the end of summer.

• Support CCD
• Connection to cold plate
• Four-side abuttabe for dense mosaic.
• Built-in mechanical precision no shimming.
• Access to bonding pads
• Local electronics
• Cable connector
• Low mechanical stress in silicon from -150 C to
  150 C.
• Low background radiation materials
• Low chemical reactivity with silicon

18
Cosmology/SNAP -gt ME
19
Linear Collider

• Linear Collider will likely be next focus of
  world-wide, accelerator-based HEP, following LHC.
• Location not known. Timescale for completion
  uncertain.
• LBNL detector development
• TPC improvements and related studies
• CCD vertex detector
• TPC
• Readout/gas studies
• Reduce structural mass(composites?)
• Integration of electronics(eg. in 0.25 micron
  processes) on endplanes -gt electrical/mechanical
  issues, including reduced mass
• CCD
• Utilize SNAP rad-hard CCD technology
• Vertex detector similar to one built for SLD

20
Other

• Cosmic Microwave Background instrumentation
• Effort to utilize large-scale HEP techniques
  for CMD instruments
• Cryogenic systems, superconducting detectors
• Underground laboratory
• Effort to push for US underground laboratory for
  dark matter searches, next generation solar
  neutrino experiments, detector for neutrino
  oscillation experiments from accelerator beams
• Cryogenic detectors, big detectors(large mass
  needed), low background
• Neutrino beams/muon storage ring
• Big neutrino detectors. Need innovations
• Astrophysical neutrinos
• ICECUBE.

21
Implications

• Diverse effort, hard to give common theme
• ATLAS, BaBar, SNAP, LC possible commonalities
• Clean space.
• Silicon fabrication equipment
• FE structural/thermal modeling, verification via
  TVH, CMMs, IR
• Composite structures
• Combined electrical/mechanical design,modeling
• Other potential experiments have additional needs