There Is More Than Moore in Automotive

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(No Transcript)
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"There Is More Than Moore in Automotive "

• Hartmut Hiller
• Infineon Technologies AG
• Senior Director Design Methodology
• Business Group Automotive, Industrial
  Multimarket

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Some Semi-conductor enabled functions of a
typical car
Nico Kelling (IFJ AIM MC)
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Automotive Microelectronics Trends ? More Than
50 of -value of Electronics is Semiconductors
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Full spectrum of semi-conductor technologies is
needed
Computing
Power Semicon. High current High
voltage High temperatures
Silicon Sensors Special processes High
precision Great robustness
Sensing
Actuating
Microcontrollers 50 m transistors Non-volatile
memory
Smart Power
SmartSensors
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While technologies for Automotive follow at a
distance
Moores Law Driver for CMOS DRAM
Source ITRS Roadmap, Infineon, Internet
Announcements
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The special challenges for Automotive Technologies
1. Extended Temperature Range -50 C to 175 C
2. Extreme mechanical stress (vibration,
pressure, temp. cycles)
3. Extreme voltages/currents for
Power-Semiconductors (Switches)
4. Long term reliability requirement
5. Large eFlash with 10 years data stability
6. Demanding ESD / EMC / EOS requirements
7. Zero Defect Requirement
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The special challenges for Automotive Technologies
QUALITY ( No compromises )
This builds the basis for our RELIGION which is
called
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Infineons Automotive Excellence Program
44th Design Automation Conference San Diego, June
2007
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We deliver "World Class Quality" from Day Zero
Quality
Effort
Wspw
Time
Functionality, Zero Defect, Yield,
Reliability, Robustness, Spec. Corners
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Unfortunately "World Class" does not come for free
The Goal
Quality
Wspw
Test-Chip
Effort
Time
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Our todays "Top 3 Challenges" (w/o good EDA
solutions)
Todays EDA Tools provide "sub-optimal" Support
for
1. The embedded Flash Challenge
2. EMC Modelling
3. To overcome the "Analogue / Digital Wall"
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1. The embedded Flash challenge
The eFlash challenges
1. Tremendous analogue complexity pushing the
tool limits ( 18 Mio Transistors ? 100 Mio
extr. Devices)
2. Complex Mixed Signal function FSI with own
CPU for calibration
3. Electro-Migration verification
4. Dynamic IR Drop verification
5. Hierarchical Extraction
6. True Latchup Issues (due to high Voltages
during write/erase)
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2. EMC Modelling
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3. The digital / analogue Wall
Abstraction
1-2 Iterations / macro
Macro
FRUSTRATION ?
AMS community / db
Full-Chip community / db


And thats what we strive for
Common database


Common Methods (example Full Chip Crosstalk
analysis ?)


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Tomorrows "Top 3 Challenges"
1. Modelling Parasitic devices
2. "Adding Brain to Power"
3. On the Way to "Zero Pin Sensors"
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1. Modelling Parasitic Devices
Modelling of parasitic devices/substrates is "the
blind spot" in todays EDA (Example
ReverseCurrent Injection for Power-Semi)
Todays solutions Expert Reviews Checklists
to ensure that proper design
measures are taken
But unfortunately you see such a problem the
first time on Si( ? lack of EDA supported
methods )
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2. "Adding Brain To Power"
Current Product (MCM)
Next Step
horizontal integration(based on IFX 130nm node)
and the Next Challenges (w/o good EDA answers)
1. Voltage Dependent Design Rules
2. New effects (parasitcs) due to substrate
coupling ? substrate Modelling
3. Diverging Time Constants (kHz ? 100s of MHz)
4. Diverging Current Ranges (µA ? some A)
5. Thermal simulation with analogue view (
matching ? isotherm req.)
6. Digital / Analogue / High Voltage Co-Design
7. . . . . . .
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3. On the Way to "Zero Pin Sensors"
European Commission 026461 e-CUBES
and the Next (EDA) Challenges coming with it
1. How to test an pin-less device (new BIST
methods)?
2. Overall System Level verification ? Full
Range mechanical thru High Speed-RF
3. Highly sophisticated System In Package (SIP)
flow / methodology needed
4. Sophisticated Power Saving techniques
5. High density interchip wiring interchip vias
6. Interchip Crosstalk
7. . . . . . .
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Conclusions
Quality Reliability are the driving forces for
Automotive
Products are facing (simultaneously) a broad
range of challenges Mechanical
Thermal Robustness Mixed Signal
Complexity ESD / EOS / EMC
The EDA issues shown are our prominent
ones beside HW / SW integration, Funct. (MS)
Verification, ESD robustness,. . . . . .
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http//www.infineon.com
Thank you for your attention
Hope you got some MORE insight why "There is
MORE than MOORE in Automotive "