Bonding meeting

1
FNAL Bonding

• We are part way through an exchange wire bonders
  with UCSB in which we have sent them a KS 8090
  machine in exchange for an 8060 machine.
• This will leave our facility with two 8090
  machines and one 8060 (and UCSB with two 8090s)
• We will update the tool_ids and I/F default
  parameters accordingly.
• The 8060 does not have sufficient clearance to
  bond TOB modules but it is capable of bonding
  hybrids.
• Recently we encountered a serious problem in
  which one particular 8090 machines was found to
  be creating pinholes at a much higher than normal
  rate. (This is not the machine that we sent to
  UCSB!)
• 11 modules were affected with an average of about
  4 pinholes per module.
• These are mostly associated with repairs. (We
  have had problems with recent hybrids.)
• The normal rate of unexpected pinholes is low,
  around 0.003 per channel.
• By coincidence a KS service technician was at
  our lab for the quarterly PM work on the 8090
  machines, and he noted that the auto-force on
  the bonder in question required adjustment.
• Since that time the pinhole rate appears to have
  returned to normal.
• With one exception all of these modules
  eventually received a passing grade after bonds
  from pinhole channels were pulled.
• Of course one might worry whether other channels
  with repaired bonds will become pinholes at some
  point.

2
FNAL Bonding

• Recently we have also had problems bonding the
  channels on the wings of the TOB hybrid PAs.
• When this happens the total module bonding time
  can more than double.
• There is some suspicion that the Dow Corning 3140
  silicone under the PA wings has not sufficiently
  hardened in the problem cases.
• Delaying module bonding by another 24 hours
  appears to help.
• We have not yet upgraded to I/F v5.1 but had
  previously modified some of the scripts to make
  it easier to go back and forth between hybrid and
  module entries.
• The good news is that D0 is done building modules
  and all bonding machines at our facility are now
  available for CMS production.
• The 8060 will be used for hybrid bonding and the
  two 8090s for module bonding.
• Three technicians are normally available for
  bonding.
• Enclosed are some trend plots of bond pull data
  that were prepared for the June Tracker week.

3
FNAL Bonding
Total Hybrids Bonded 353 Total Hybrid Pulls 42
4
FNAL Bonding
Total Modules Bonded 413 Total Test Pad
Pulls 47
5
FNAL Bonding