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ECE 425 VLSI Circuit Design

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Generates enlarged master image of each mask layer. Image printed ... Too much material - 'bloat' Too little material - 'shrinkage' Misalignment. Typical rules: ... – PowerPoint PPT presentation

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Title: ECE 425 VLSI Circuit Design


1
ECE 425 - VLSI Circuit Design
  • Lecture 4 - Layout Design Rules
  • Spring 2005

Prof. John NestorECE DepartmentLafayette
CollegeEaston, Pennsylvania 18042nestorj_at_lafayet
te.edu
2
Announcements
  • Reading
  • Wolf 2.4-2.6

3
Where we are...
  • Last time
  • Transistor Modes of Operation
  • More about Wires Vias
  • Parasitics
  • Today
  • Parasitics continued (Lecture 3 pp. 28-40)
  • Layout Design Rules Stick Diagrams
  • Discuss Lab 3

4
Mask Generation
  • Mask Design using Layout Editor
  • user specifies layout objects on different layers
  • output layout file
  • Pattern Generator
  • Reads layout file
  • Generates enlarged master image of each mask
    layer
  • Image printed on glass reticle
  • Step repeat camera
  • Reduces copies reticle image onto mask
  • One copy for each die on wafer
  • Note importance of mask alignment

5
Symbolic Mask Layers
  • Key idea
  • Reduce layers to those that describe design
  • Generate physical layers as needed
  • Magic Layout Editor "Abstract Layers
  • metal1 (blue) - 1st layer metal (equiv. to
    physical layer)
  • Poly (red) - polysilicon (equivalent to physical
    layer)
  • ndiff (green) - n diffusion (combination of
    active, nselect)
  • ntranistor (green/red crosshatch) - combined
    poly, ndiff
  • pdiff (brown) - p diffusion (combination of
    active, pselect)
  • ptransistor (brown/red crosshatch) - combined
    poly, pdiff
  • contacts combine layers, cut mask

6
About Magic
  • Scalable Grid for Scalable Design Rules
  • Grid distance l (lambda)
  • Value is process-dependent l 0.5 X minimum
    drawn transistor length
  • Painting metaphor
  • Paint squares on grid for each mask layer
  • Layers to interact to form components (e.g.
    transistors)

7
Mask Layers in Magic
  • Poly (red)
  • N Diffusion (green)
  • P Diffusion (brown)
  • Metal (blue)
  • Metal 2 (purple)
  • Well (cross-hatching)
  • Contacts (X)

8
Magic User-Interface
  • Graphic Display Window
  • Cursor
  • Box - specifies area to paint
  • Command window (not shown)
  • accepts text commandspaint polypaint
    redpaint ndiffpaint greenwrite
  • prints error status messages

9
Layer Interaction in Magic
  • Transistors - where poly, diffusion cross
  • poly crosses ndiffusion - ntransistor
  • poly crosses pdiffusion - ptransistor
  • Vias - where layers connect
  • Metal 1 connecting to Poly - polycontact
  • Metal 1 connecting to P-Diffusion (normal) - pdc
  • Metal 1 connecting to P-Diffusion (substrate
    contact) - psc
  • Metal 1 connecting to N-Diffusion (normal) - ndc
  • Metal 1 connecting to N-Diffusion (substrate
    contact) - nsc
  • Metal 1 connecting to Metal 2 - via

10
Magic Layers - Example
11
Lab 2 - Introduction to Magic
  • Preparation
  • Read Prof. Stines Magic Tutorial
  • Read Magic Tutorials 1 2
  • In the Lab
  • Use the PCs running Linux - log in with CS
    account or using login ece / password ece
  • Do Step by Step Example in Magic Tutorial
  • Create a layout for a 3-input NAND gate
  • Plot with flea and hand in

12
Design Rules
  • Motivation Fabrication is not exact
  • Too much material - bloat
  • Too little material - shrinkage
  • Misalignment
  • Typical rules
  • Minumum size
  • Minimum spacing
  • Alignment / overlap
  • Composition
  • Negative features

13
Types of Design Rules
  • Scalable Design Rules (e.g. SCMOS)
  • Based on scalable coarse grid - l (lambda)
  • Idea reduce l value for each new process, but
    keep rules the same
  • Key advantage portable layout
  • Key disadvantage not everything scales the same
  • Not used in real life
  • Absolute Design Rules
  • Based on absolute distances (e.g. 0.75µm)
  • Tuned to a specific process (details usually
    proprietary)
  • Complex, especially for deep submicron
  • Layouts not portable

14
SCMOS Design Rules
  • Intended to be Scalable
  • Original rules SCMOS
  • Submicron SCMOS-SUBM
  • Deep Submicron SCMOS-DEEP
  • Pictorial Summary Book Fig. 2-24, p. 27
  • Authoritative Reference www.mosis.org

15
SCMOS Design Rule Summary
  • Line size and spacing
  • metal1 Minimum width3l, Minimum Spacing3l
  • metal2 Minimum width3l, Minimum Spacing4l
  • poly Minimum width 2l, Minimum Spacing2l
  • ndiff/pdiff Minimum width 3l, Minimum
    Spacing3l, minimum ndiff/pdiff seperation10l
  • wells minimum width10l, min distance form well
    edge to source/drain5l
  • Transistors
  • Min width3l
  • Min length2l
  • Min poly overhang2l

16
SCMOS Design Rule Summary
  • Contacts (Vias)
  • Cut size exactly 2l X 2l
  • Cut separation minimum 2l
  • Overlap min 1l in all directions
  • Magic approach Symbolic contact layer min. size
    4l X 4l
  • Contacts cannot stack (i.e., metal2/metal1/poly)
  • Other rules
  • cut to poly must be 3l from other poly
  • cut to diff must be 3l from other diff
  • metal2/metal1 contact cannot be directly over
    poly
  • negative features must be at least 2l in size
  • CMP Density rules (AMI/HP subm) 15 Poly, 30
    Metal

17
Design Rule Checking in Magic
  • Design violations displayed as error paint
  • Find which rule is violated with "drc why Poly
    must overhang transistor by at least 2 (MOSIS
    rule 3.3)

18
Stick Diagrams
  • Key idea "Stick figure cartoon" of a layout
  • Useful for planning layout
  • relative placement of transistors
  • assignment of signals to layers
  • connections between cells
  • cell hierarchy

19
Stick Diagrams (cont'd)
20
Stick Diagram Examples
21
Stick Diagram Examples
22
Example Layout / Stick Diagram
  • Create a layout for a NAND gate given
    constraints
  • Use minimum-size transistors
  • Assume power supply lines pass through cell
    from left to right at top and bottom of cell
  • Assume inputs are on left side of cell
  • Assume output is on right side of cell
  • Optimize cell to minimize width
  • Optimize cell to minimize overall area

23
Layout Example
Exterior of Cell
Circuit Diagram.
24
Example - Stick Diagrams
Alternatives - Pull-up Network
Circuit Diagram.
Pull-Down Network (The easy part!)
Complete Stick Diagram
25
Example - Magic Layout
  • Overall Layout 52 X 16

26
Lab 3 - Layout from Stick Diagrams
  • Design an AOI-22 gate
  • Logic function (AB CD)
  • Follow the constraints given in the lab handout
  • Start with a stick diagram
  • Create a Magic layout
  • Minimize height and overall area
  • Hand in flea plot marked with dimensions at end
    of lab
  • Hand in Technical Memorandum w/ plot in lab
    next week.

27
Coming Up
  • Hierarchical Layout
  • Review Levels of Abstraction
  • More Layout CAD Tools Extraction, LVS
  • ASIC Layout Styles
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