Bonding meeting

1
FNAL Bonding

• Since our last report we have built and bonded an
  additional 10 TOB 4-chip modules
• 3 RMT pitch adapters
• 7 Planar pitch adapters
• By adjusting bonding parameters on a case by case
  basis for the RMT modules we were able to
  eliminate all of the sensor-to-PA bond repairs.
• Last fall we reported a 2 repair rate
• Pull test results for the RMT PAs were still low
  (6-8 grams) even with the bond parameter tuning,
  but with the transition to Planar PAs this is no
  longer an issue. See the enclosed histogram.
• Bonding time for the Planar modules is typically
  around 10 minutes. An additional 15 minutes is
  needed for the sensor-to-PA pull tests and
  rebonding.
• We are assuming that pull tests will not be done
  for the majority of modules during normal
  production.
• With the change in the way ST sensors are tested
  data is no longer entered into the DB in a
  standard way, and this is giving us difficulties
  in determining bad channel information for wire
  bond skips and may also lead to difficulties with
  the Bonding interface.

2
FNAL Bonding
Average pull strengths from the every 50th wire
sen-to-PA pull tests. Modules 702-708 have RMT
PAs modules 709-715 have Planar PAs.