Ming-Cheng Sheng

1
?????????????

• Ming-Cheng Sheng
• ASEKH-IT
• April 9, 2003

2
Agenda

• IT Requirement for Assembly Testing House
• Business Model
• ASEKH-Test IT Systems
• CIM/MES
• EIT
• ERP
• B2B
• The Role of IT
• Some Lessons from Our OJT

3
??????????
4
??????????????

• DESIGN HOUSE (???)
• ???? (Product Request)
• ???? (Circuit RD)
• ???? (Simulation)
• ???? (Circuit Layout)
• ???? (Layout Simulation)
• ???? (Mask)
• ???? (Czochralski Growth)
• ???? (Wafer Slice)

5
??????????????

• WAFER FAB (???)
• ???? (Wafer Process)
• ?????
• ?????
• ??????
• ????
• ????
• ????
• ???? / ????
• ????
• ????

6
??????????????

• ASSEMBLY HOUSE (???)
• ???? (Wafer Saw)
• ?? (Die Attach)
• ?? (Wire bond)
• ?? (Molding)
• ???? (??/??/??..)
• ???? (Trim form)
• ?? (Top Mark)
• ?? (Inspection)

7
??????????????

• TESTING HOUSE (???)
• ???? (Wafer Sort)
• ???? (Burn In)
• ???? (Final Test)
• ???? (V/M Inspection)
• B/L ASSEMBLY (?????)
• ???? (Surface Mount Technology)
• ???? (PCB Module)
• PRODUCTION LINE (?????)
• ???? (Final Product)

8
Process Flow Introduction
MES Subsystem
Process

• Process Flow
• Wafer Sort
• Final Test
• Burn In (TDBI)
• Lead Scan
• TR (Dry pack)

• Incoming Material Type
• Wafer from Fab.
• 70 Package from ASEK.
• 30 Package from other Assembly House.

• Outputs
• Summary
• Wafer Map
• Yield Report
• QC Data

TESTING HOUSE Turn Key Business Solution
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Wafer Sort

• Wafer Incoming Inspection
• ESD Grounding Protection
• Inkless Operation
• Wafer Mapping Trace Form

Operation

• Wafer Sort Set Up Procedure
• In-Process Statistical Process Control (SPC)
• Manufacturing Execution System (MES) Lot Tracking
  Reporting
• Probe Card Maintenance
• Clean Calibration
• Preventive Maintenance

Calculation Analysis

• In-Line Yield SPC Chart
• Stack Wafer Map
• Yield Report and Trend Chart
• Correlation Process Control

Charts Controls
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Wafer Sort Process Flow (1)

• Wafer Sorting
• Sorter capability
• Sorter PM
• Vacuum pen handling
• N2 cabinet handling

• Wafer Map control
• Data confirmation
• Data transfer

IQA
ID Sorting
CP
Wafer Map
Foundry

• Circuit Probing
• Prober PM and calibration
• Set-up procedure and handling
• Yield monitor
• Probe mark and wafer V/M check
• Data collection procedure

• Incoming Quality Gate
• Loader/Unloader PM
• Microscope handling
• De-pack handling
• Wafer V/M check

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Wafer Sort Process Flow (2)

• Wafer Baking
• Oven PM and Calibration
• Cassette transfer handling
• Temp. and Time definition
• Visual Inspection

• Wafer outing packing
• Material storage
• Cassette transfer handling
• Sorter PM and operation
• Shipping data preparation
• Packing procedure

• Laser Repair
• Fuse Cutting
• ESI-9200/9300

Inking
Bake
QA
Pack
OQA
Laser Trim

• Quality Gate
• Loader/Unloader PM
• Microscope handling
• Wafer V/M check
• CP data confirmation and update

• Outgoing shipping gate
• Packing material check
• Shipping data

• Wafer Inking
• Prober PM and calibration
• Inking operation
• Ink related specification
• Ink check procedure

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Wafer Sort Capability
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Final Test

• IC Incoming Inspection
• ESD Grounding Protection
• In Process Visual Mechanical (V/M)
• Monitoring
• In Process Yield Monitor Socket
• Cycle Time Control

Operation

• Final Test Set Up Procedure
• MES Lot Tracking Reporting
• Load Board Maintenance
• Clean Calibration
• Preventive Maintenance

Calculation Analysis

• In-Line VM Yield Control Chart
• Daily/Weekly/Monthly Yield
• Report and Trend Chart

Charts Controls
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Final Test Process Flow (1)

• Burn In Capability
• BIB Design Build
• Auto Load/Unload
• Test During Burn In.
• Burn In Set Up Sheet

• Electrical QA Gate
• AQL 0.1
• QA Reject Handling Procedure
• Quality Report

ASE Other Assembly House
IQA
Burn In
Final Test
QA

• Final Test
• ESD Grounding Protection
• In Process V/M SPC Control
• Bin Operation Control
• Yield Control Procedure
• Fast TAT and Cycle Time Control

• Incoming Quality Gate
• Lead Scanning
• Visual Eye Inspection
• Incoming Data Check
• Wafer Inspection Capability

TESTING HOUSE Turn Key Business Solution Provider
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Final Test Process Flow (2)

• Lead Scan Capability
• Copl. Bend Lead
• Stand Off / Skew
• Ball Quality Inspect.
• Visual Inspection

• Tape Reel Capability
• Multi-Material Source
• Kit Availability
• Peel Strength SPC.
• Drop Test Qualification

Front End W/S, F/T, B/I
Top_mark
Lead Scan
Bake
TR
Pack

• Bake Capability
• Bake Temp 125 C
• Bake Hour 8 Hrs
• Window Time 4Hrs
• Real Time Bake Oven Monitoring System

• Pack Drop Ship
• Dry Pack
• Pack MTL Design
• Label Design Data Linking
• Colorful Packing System

• Top Mark Capability
• Ink mark Laser mark
• Control by Set up procedure / SOP/TCM/
• Package from other Assembly House.

TESTING HOUSE Turn Key Business Solution Provider
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??????????????

• IC??????????????
• ????????
• ???????(Drop shipment service)
• ????????????
• ????Hold ???,?????????????
• ?????????
• ?????????? (Subcon)
• ?????IC ???????,??????
• ?????????????

17
??
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Yield Judgment Handling
Pre-Test
Pre-Test
Yield gt 90
Test
Yield lt 90
Test
Hold Inv
ELSE
Yield LT 90
Test 2
END_IF
ELSE
Hold Inv
END_IF
Burn In
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MIS System Architecture
CRM B2Bi,Virtual Factory(quick respond
system),IRS,Standard report,KM
ERP SD FI/CO PP MM QM

• PDM
• Document Management
• Product Data
• Product Structure Management
• EC Management

CIM PT SFC EDC/SPC Alarm FA
OA Workflow(HR,QA,CS,ENG) E-mail FTP Document
center Web(intranet/internet)
Infrastructure
(4) Network Infrastructure (Internet,WAN,LAN Intra
net Extranet VLAN,ISDN)
(1) Common Business Services Infrastructure (virus
,firewall)
(3) Multimedia Content and Network Publishing
Infrastructure (HTML,JAVA,World Wide Web,ASP)
(5) Interfacing Infrastructure (Todatabases, cust
omers,and applications)
(2) Messaging Information Distribution Infrastruct
ure (EDI,e-mail,FTP,E-FAX)
MANAGEMENT
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CIM Hardware Architecture
PROMIS Server
Report Server
CELL Server
4.3 GB HD20(Disk Array) 9GB HD 4 18GB HD
2 OpenVMS 7.1 C, DEC C FORTRAN 7.1-1 PROMIS
5.5 TIB/RV4.2 Report Gateway v2.2
9.1 GB HD12 (Disk Array01) ORACLE DB
8.0.5 9.1 GB HD4 (Disk Array5) INTENCH
AP 18 GBHD 2 DB Backup
18 GB HD11 (Disk Array01) Oracle Data
8.0.5(Rpt) 9 GB HD 4 (Mirror) DB
Backup 9 GB HD2 (Mirror) Redo Log
Rollback segment 9 GB HD2(Mirror) Archive
Log 9 GB 1 (Standalone) Oracle Data
(Webdb)
HSJ 50
HSJ 50
HSZ 80
10.12.20.6
HSG 80
(Secondary) Alpha ES40-2 2GB RAM 9.1GB2 local
HD(OS)
(Primary) Alpha ES40-1 2GB RAM 9.1GB2 local
HD(OS)
(Secondary) Alpha ES40-2 1GB RAM 18 GB2
local HD (OS,ORACLE)
(Primary) Alpha ES40-1 2GB RAM 18 GB2 local HD
(OS,ORACLE)
(Secondary) Alpha 4100(5/400)-2 2GB RAM
(Primary) Alpha 4100(5/400)-1 2GB RAM
ASE1 10.12.20.2
ASE2 10.12.20.4
ASE3 10.12.20.31
ASE4 10.12.20.21
ASETRPT1 10.12.20.7
ASETRPT2 10.12.20.9
Gateway 10.12.20.254 Mask255.255.255.0
TCP/IP TIB/RV4.2
MES_CELL_1 10.12.20.8
ASET-AP 10.12.15.13
ASET-WS2 10.12.51.5
ASET-WS1 10.12.51.4
ASET-AP1 10.12.15.23
PIII-5502 NT 4.0C 1GB RAM 9.1GB HDD 3 Oracle
8.0.4 TIB/RV4.2 TP Server Alarmsvr DBsvr VGS
P3 Xeon 700Hz / 1MB NetServer LT 6000r
9.1G Hot Swap X3
P3 Xeon 700Hz / 1MB NetServer LT 6000r
9.1G Hot Swap X3
NetServer LC II P II 266Hz
160M ECC SDRAM 18GB X3,Ultra160 68 pin,10,000RPM
NetServer LC II P II 266Hz
160M ECC SDRAM 9.1G 4.2G
10.12.20.16
S/W Setup Procedure Server
Storage 18G Hot Swap X4
ASET-WS1 10.12.51.3
TP Server
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CIM Current System Architecture
WS Cell Server
VMS Server MES Database(PROMIS) Lot Information
,Recipe
FT Cell Server
MES Cell Server PT,Setup,Maintenance, Configuratio
n Table
Wafer Map Raw Data
Test Result,SPC Data,UPH data
Reporting Server
Probe Data
Transaction .Setup .Track In .Maintenance
.Data collected .Track Out
Report Client
Reporting .WIP Data .Yield Data .Cycle
Time .Output .Performance
GUI Client
Handler
Data Collection .Wafer Map .Bin Summary
.SPC Data .UPH
Auto Data Collection System
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CIM Future System Architecture
WS Cell Server
VMS Server MES Database(PROMIS) Lot Information
,Recipe
FT Cell Server
MES Cell Server PT,Setup,Maintenance, Configuratio
n Table
Wafer Map Raw Data
Test Result,SPC Data,UPH data
Reporting Server
Probe Data
Prober
Transaction .Setup .Track In .Maintenance
.Data collected .Track Out
EAP Cell Server
Report Client
Setup M/C .Recipe download Data Collection
.Engineering data .Equipment data
GUI Client
Reporting .WIP Data .Yield Data .Cycle
Time .Output .Performance
Tester
Data Collection .Wafer Map .Bin Summary
.SPC Data .UPH
Tester
Handler
Auto Data Collection System
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CIM F/E Framework
Layer 3 Planning layer (ERP/SCM)
Planning data
Shop floor data
CIM server
EDA Server
Layer 2 Execute layer (MES)
WS Online
FT Online
Yield Management
EMS
SPC
RMS
FAB Resource Management
Layer 1 Control layer Automation (PC/EPQ)
Program download
LAN
WS File Server
EDC Server
WS AP Server
Summary data
Panel PC
LAN
Tester Workstation
Shunt Box
SECS
TTL/GPIB
GPIB
Tester
Handler
Prober
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CIM B/E Framework
Layer 3 Planning layer (ERP/SCM)
Planning data
Shop floor data
EDC Server
CIM server
Layer 2 Execute layer (MES)
WS Online
FT Online
Yield Management
EMS
SPC
RMS
FAB Resource Management
Layer 1 Control layer Automation (PC/EPQ)
SPC File Server
SPC Database
LAN
Panel PC
LAN
LAN
LAN
LAN
SPC summary Upload
RS-232
Temp. monitor
Job download
Job download
SPC summary Upload
Scanner
Marking
Bake
TR
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ASET Engineering Information System Relation
Diagram
MM(BOM)
PCS
PEDB
TEV
Color Packing
APQP
F/E
B/E
MES
ERP/SCM
Spec
Setup procedure
BIMS
B/I Oven monitor
BCS
Setup Matrix
Correlation sample
Tooling
H/W config.
Spare board
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Product Testing Engineer PTE
Asset Control Diagram
Testing Engineering Control Center TECC
Verify
Incoming Send Back
Production Engineering Use
Repair PM
L/B Repair Room
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Glance at Setup Procedure
Device Name Lead Count PKG
IBM610 256
BGA
Bin Status Remark 1 Good
Pass 2 Fail O/S
S/W Bin information
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SCM
Logistic MFG
ERP/FRP
FT/WS/BI setup procedure
Tooling
BI oven
H/W
Disposition
Tooling
MM

• Matrix
• MFG/LB
• BCS
• Disposition
• BI oven
• Spare board
• Correlation
• Tools
• PM
• Test prgm mgem.
• H/W config.

PDM
RBOM MBOM Routing

• SPEC
• EC
• TEV
• FT/WS/BI Spec
• Routing

• PCS
• APQP
• PEDB (BOM/color packing

ENG
EIS
MFG
PEDB Color packing
Yield/Setup
SPEC
FT/WS/BI setup procedure
TEV
MES
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Capability of PDM

• New Version Control
• Event Alert
• APQP / EC Monitor
• Internet Approval Available
• Better Turn-key Service
• Collaboration Mechanism
• Efficiency Manufacturing

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(Current ERP System Architecture)
Notes AP
By ASET
TDRP
ASRS
Package
Setup Procedure
Shipping
PT
Plan
Price
Label
PO
MES
E-PR
MM
PEDB
SAP/FI
HR
E-HR
Invoice
Packing
GUI
AOL
Intranet
Internet
Equ Time Record
Spare Parts
Tooling
Bonus
Cost
Extricity
FCST
TSMC Ship Instr.
MES Menu
TEV
Hold Bank
SPEC
CAR
TesterConfig
Hold Lot
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ERP Applications
Operation
Distribution
SCM

• Forecast
• PC Plan
• HR
• Bonus
• Program Version
• Control System

• Cust. PO Control
• Quotation
• Pricing
• Shipping Notice
• Invoicing
• Packing List
• Labeling

• Finance
• Cost
• GUI
• Purchase
• Inventory Man.
• Bond

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ERP Capability

• Flexible PO/Pricing Control to meet
• Customer requirement
• Flexible Shipping Doc to meet Customer req.
• including Invoice
• Packing List
• Inner box Label
• Outer box Label
• Material Control
• Inventory Management
• Good AP/Report Version Control

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GRP Project Scope
SCM
Quotation

• Sales/Distribution
• Order Entry
• Pricing Service

Quotation

• Production Planning
• Scheduling
• Material Planning

• Purchase
• Material Control
• Purchase

ERP (SAP)
PR
PO
Production Order
Production Control
Final Test
ASSY
Wafer Sort
Wafer issue
Finish Goods
Inventory Control
Customer
Vendor
Receive
Warehouse Management
Pick / Pack
Shipping
RT
????
Invoicing
Validate
invoice
Material/FG/Shipping Records
Invoice
invoice
Invoice

• Finance/Costing
• GL AR AP
• Asset Management Budget/Cost Control
  Treasury

Payment
Payment
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Future System Architecture
IRS
HR
Other Notes AP
MM/QM
SD
FI/CO
PP
SCM
MES
1.Setup Proc. 2.PEDB 3.Tooling .
Label
E-PUR
1.???? 2.????
AS/RS
35
Future Capability

• Utilization
• Configure
• Auto linkage

• Speed up
• Cust. Req.
• Reduce
• Manpower

36
ASE B2B Architecture
37
RosettaNet PIPs Supported
PIP Description Supported
PIP 3D8 V01.00 Distribute Work In Process 2001
PIP 3B2 V01.00 Notify of Advance Shipment 2001
PIP 3A4 V02.00 Request Purchase Order 2001
PIP 3A7 V02.00 Notify of Purchase Order Acknowledgement 2001
PIP 3A8 V01.00 Request Purchase Order Change 2001
PIP 3A9 V01.00 Request Purchase Order Cancellation 2001
PIP 3C3 Notify of Invoice 2002 Q3
PIP 3C4 Notify of Invoice Reject 2002 Q3
PIP 7B5 Notify/Request Work Order 2002 Q4
PIP 7B6 Request Work Order Status 2002 Q4
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B2B BUSINESS PROCESS INTEGRATION
ASE Test
End_Customer
Customer
Business Application system
Business Application system
Business Application system

• Purchase order
• Forecast
• Shipping Instruction
• Eng. Spec

• PO confirmation
• S.O.D reply
• WIP / Inventory
• Yield Data, QC data
• Shipping documents
• Invoice

• Shipping documents

The data interchange would be performed by
Extricity, FTP protocol.
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File Transfer Protocol

• 1.FTP (File Transfer Protocol) 
• 2.HTTPS (File upload Web server) 
• 3.B2B (Platform Extricity)  
• 4.E_mail 
• 5.Web Site

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Data Format
RosettaNet XML are our preferred approach

• Txt file (ASCII)
• Most popular
•  XML (DTD)
• Data Type Definition, easy to de_code
•  RosettaNet XML channel
• Secured system environment
• High system availability
•  Flat File(Excel File)
• Easy to use for end user

41
CIM/ERP/SCM/PDM/CRM Integration
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The Role of IT

• Service
• Passion
• Key on Process Integration
• Communication facilitator
• Conceptual Modeling

43
What IT Can Server for You

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Our Policy and Challenge

• Win-Win-Win Policy
• You Pay Some but Win More
• I Pay Some and Win More, Also
• Our Customers Win, Our Mission
• Key Success Factors
• Best Practices
• Effective/Efficient Information Chain
• Learning and Improvement

45
Q A
Thanks for your attention.