LOI: Letter of Intent (?) FPCCD VTX. Short term plan. Study of fully depleted CCD ... The 1st test sample of FPCCD is expected to be made by Hamamatsu in FY2007 ...
Fine pixel of ~5mm (x20 more pixels than 'standard' pixels) to keep low pixel occupancy ... Fine Pixel CCD. Z. f. Low Pt. b.g. High Pt. Signal. B.G. rejection ...
Deformation by self-weight is calculated by. FEA program COMSOL. 10. FEA of Ladders ... Maximum deformation: Without gap : vmax=0.536 mm. With 0.2mm gap : vmax ...
... CCD. Design of small. Prototype of FPCCD. FPCCD. fabrication. Sample test ... LOI: Letter of Intent (?) FPCCD VTX. Short term plan. Study of fully depleted CCD ...
High density design. R.O. during train -20 frames/train -High speed readout. Idea of FPCCD ... Low Pt. b.g. High Pt. Signal. B.G. rejection by hit cluster shape ...
16/32 ch Amp-CDS-ADC with 0.635 mm pitch. System noise 50 electrons (depends on CCD) ... KEK Annual budget 'A' Electronics. Fine Pixel. Standard size. G ...
Wafer thickness less than 50 mm is desirable for the ILC ... Standard etching technique gives twafer=tepi. SOI technology could achieve 50 mm twafer tepi ...
Two Interaction Points. One with small crossing angle (0~2 mrad) ... Accumulate hits in one train and readout between trains. No effect by beam-induced RF noise ...
... 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 i 1 ... E 9G*dkEr.Nj* =4n lSf a] ...