Module and Stave Production Status

1
Module and Stave Production Status

• James Fast
• Fermilab

2
L1 Module Tooling

• Follows closely the L2-5 module tooling design
• Assembly fixture the same as 10-10 fixture design
• Center and end vacuum pucks altered for smaller
  sensor size
• Bonding and transfer fixture is the same design
• Fixture and vacuum grooves scaled down for
  smaller module size
• Flip fixture
• Must accommodate bonding of Kapton circuit over
  full module surface
• Most drawings approved for fabrication
• Need to adjust Flip fixture to final hybrid
  HV/GND pad locations
• Production fixtures
• Finalize design dependent on final hybrid
  sign-off (12/03)
• Production schedule to start 1/28/04
• Probably possible to do production earlier
• Mechanical aspects of hybrids should be stable
  earlier

3
L1 Module Fixture
4
L1 Electrical Modules

• One prototype built (long, long ago)
• ELMA sensors
• Hybrid aligned by hand and by eye
• Kapton HV/GND circuit was not used
• To Do List
• Verify tooling and procedures with mechanical
  parts
• Assemble single-sensor module for glue
  irradiation test
• Want to use HPK sensor so we have the correct
  structures oxides
• Will be irradiated at KSU to look for noise or
  leakage current issues
• Final test to certify use of TDR 1100-11 epoxy
  for use on sensors
• Assemble at least 2 electrical modules
• Need HPK sensors for these
• May need new Kapton flex circuit for HV/GND
  connection (depends on hybrids)
• Develop OGP survey program and database
  infrastructure
• Need above modules with correct fiducials
• Need initial output file to write script to
  massage data for DB
• Need to write procedures as programs are
  developed
• Final design and fabrication of Kapton circuits
  for HV/GND connections

5
L0 Module Tooling

• Flex cable tools
• Attach ceramic to cables A and B
• Laminate cables B onto cable A with Kapton mesh
  spacer in between
• Current plan is to do this at Fermilab
• Sensor sub-assembly tooling
• Attach flex to sensor for HV and ground contacts
  to HV filter
• Install HV filter card and connect flex to HV
  filter
• Provide referencing of sensor so it is located
  for next step
• Sensor/flex/hybrid assembly tool
• References cables with pins through holes in ears
• Dead weights hold cable down on sensor and hybrid
• References hybrid with pins to edges of substrate
• Vacuum holds hybrid in place
• References sensor from edges
• Problematic as Kapton is already in place no
  good edges
• Needs to be integrated with previous fixture for
  preparing sensor
• Bonding tools
• Need tooling to hold sensor and hybrid for
  bonding
• Most likely we will use assembly tooling for
  bonding also

6
L0 Electrical Modules

• Only ELMA sensors available for this
• Initial modules used SVX2 HDIs from Run IIa
• Used for initial studies of analog cables
• Second round of modules used L1 hybrids (4-chip
  versions)
• Study of noise due to capacitance of analog
  cables with SVX4
• Study effects of cable spacing
• Study noise pickup from support structure
• Third generation
• Two sets of cablesensor to the same 10-chip
  hybrid
• Direct comparison of in-house lamination to
  Dyconex lamination
• Includes jog in analog cables
• First real prototypes
• Made with 2-chip hybrids and V1 SVX 4 chips
• Narrowed ELMA sensor used (to fit in L0A location
  on structure)
• Some difficulties with current draw and noise
  under study
• Second real prototypes
• Use 2-chip hybrids with V2 SVX4 chips
• Two modules being built with non-cut sensors, 2
  cable lengths (for L0B)

7
Other Issues for Production

• Training of additional personnel
• Gang assemble Coincides with shutdowntech
  shortages expected
• Module assembly (Need second technician to join
  Jim Wish)
• Burn-in (Cecil plus some students to replace
  Gustavo)
• Debugging (hybrids and modules big void now)
• Stave assembly (Done by engineers so far)
• Need to emphasize care in handling and
  cleanliness
• Damaged parts cost substantial amounts of
  manpower debugging and repairing, in addition to
  lost part and value-added costs
• Rework of parts will also cause unacceptable
  slipping in the schedule
• Our goal should be ltlt1 damage in assembly
  testing
• Requires all involved undergo real training in
  how to handle Silicon
• We cannot expect a priori understanding of the
  delicacy of Si modules
• Requires 110 care always take the low-risk
  approach
• E.g. using carts to move parts rather than hand
  carrying them
• Always double check (cables on right?, clamps are
  installed correctly?)
• Requires written procedures for everything,
  followed by everyone
• Supervisors and managers need to set a good
  example
• Every part Ive broken was a result of not
  following a safe procedure that was developed or
  not spending time to develop a safe procedure and
  document it (fortunately most were mechanical
  parts!)

8
Other Issues for Production

• Storage space
• Need to evaluate space in Lab D for sensors and
  gangs
• Less space available with CMS using 1/3 of the
  cabinets there
• Dry box cabinet designed and prototype paid for
  by SiDet
• Designed with two extra shelves at inconvenient
  heights
• Can accommodate Run IIa remnants and IIb
  prototype modules
• Burn-in area needs 8-10 of these cabinets
• Lab D needs 1 (2?) for module storage between
  assembly and bonding
• SiDet prototype can be used there
• May need 1 or 2 in Lab C for modules waiting to
  go into staves
• Assembly of box nearly complete now
• Need to sign-off on cabinets and get them ordered
  soon
• Larger boxes in Lab C can be used for staves L0
  modules
• Need to relocate Run IIa test structures and HDIs
• Use extra shelves in new boxes
• Need to evaluate if existing space is sufficient
• Need to design fixture/box for storage and
  testing of staves
• Needs to incorporate active cooling
• Need garages to go over L0 and L1 structures
  and barrels during assembly and testing in Lab C

9
Summary

• The tooling design for modules is flexible so
  that we can easily increase production rate. All
  tooling has been prototyped and performs very
  well.
• Stave assembly tooling has been prototyped
  successfully. Second prototype, thought to be
  production tool, has been received. Flatness of
  tools is still an issue and we are discussing
  this with the MSU shop.
• First production tooling has been ordered (20 cm
  gang fixtures) and parts have started to arrive.
• We are in very good shape with the remaining
  production tooling designs and are waiting only
  for final hybrid designs, assembly and testing of
  electrical prototypes to sign-off.
• Main bottleneck has been availability of hybrids
  and sensors for fabrication of prototype modules.
• Testing, debugging etc. needs to ramp up.