CCD Packages and Focal Plane V2 - PowerPoint PPT Presentation

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CCD Packages and Focal Plane V2

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... Focal Plane V2. Some successes in packaging and testing ... New Packages on the way. S1-08 and S1-09 taking out glue from connector. S1-11 is ready to test ... – PowerPoint PPT presentation

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Title: CCD Packages and Focal Plane V2


1
CCD Packages and Focal Plane V2
  • Some successes in packaging and testing
  • Towards Choosing directions for RD for V2

HTD Feb-01-2007
2
S1-04
  • Works
  • Bright pixels

3
S1-06
  • Works
  • Bright pixel
  • a scratch
  • (procedure changed after that)

4
S1-10
  • Works
  • I thought there would be a bright pixel
  • Can still see the tape, of course

5
Discussion and plans for V1
  • S1-01 to S1-03 wouldnt readout out. S1-05 broke
    off Nanonics connector. S1-07 wouldnt wirebond
  • But 3-in-a-row V1 packages that made it to the
    test stand a row have worked. First time we have
    had that kind of success
  • What we are doing that is different
  • ESD-safe shoes?
  • Michelle is getting more experience and more
    comfortable with the job?
  • New Packages on the way
  • S1-08 and S1-09 taking out glue from connector
  • S1-11 is ready to test

6
What to package this week
  • We are behind on pedestal packaging testing so
  • Two picture frame packages
  • Do not use thinned 2kx4k OR thinned 2kx2k devices
  • How many picture frame cards in hand?
  • IF 2kx4k are in hand (control wafers)
  • Do not use 112094.6.1 or 112094.8.2
  • Use 112094.6.2 and 112094.8.4 are ok to use
  • OTHERWISE
  • whatever we already have parts for
  • especially if we have thinned 1/2k x 1k

7
Two Possible V2 Package Directions
Electronics vs Focal Plane Package
  • Option A (not like V1)
  • HiRose connector and JFET on ALN (no CCDI),
    kapton cable stays with device
  • Focal plane slots bigger
  • Questions
  • JFET fits on ALN? Package flat enough (FEA)?
    Focal Plane flat enough (FEA)?
  • Option B (similar to V1, see next slide)
  • Nanonics Connector and CCDI, CCDI and kapton
    cable stays with device
  • Focal plane slots bigger
  • Questions
  • Focal Plane flat enough (FEA)?

8
HIRose and JFET on AlN
Option A
Terry Shaw
9
Decoupled Plans
  • Greg Derylo is aiming at a thinner package
  • so it can have wirebond repairs
  • Question Will it be flat enough (FEA)?
  • Possibly all-AlN pedestal
  • better mechanically, less packaging steps
  • Question Can these be manufactured and how do
    they compare flatness-wise?
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