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Corial 300
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Equipment Control Software

• COSMA Software with
• Edit menu for process recipe edition,
• Adjust menu for process optimizing,
• Maintenance menus for complete equipment control
  via internet with VPN (Virtual Private Network).

• CORS Software for
• Data reprocessing (Measures and data comparison).

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A Tool Organized in Successive Levels
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Diagram Modes
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A Communicant Tool
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Pumping System
Reactor
TV
TMP
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RIE Reactor
Bottom Electrode
Automatic Match Box
Pump
Pumping grid
RF Generator
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Reactor Features

• New RIE designed to achieve highly uniform
  delayering for ?300 mm wafer yield analysis
• Symmetrical reactor design to reduce ion
  bombardment on the powered electrode (cathode),
• Etching with thick insulator on the cathode to
  reduce ion bombardment.
• Real time access to the following plasma modes
• High Pressure Reactive Ion Etching (Isotropic),
• Low Pressure Reactive Ion Etching (Anisotropic).

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Some Process Specifications
Process
Underlayer
Etch Rate (nm/min)
Selectivity
Uniformity
Polyimide Si3N4 SiO2
Si3N4 SiO2 SiO2
gt50 3 1
200 120 40
5 5 3
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Preventing Overetch

• The latest submicron technology needs precise
  delayering
• Automatic endpoint detection,
• CCD camera with magnification gt 120 X,
• Laser beam diameter 20 ?m.

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Laser Endpoint Detection
Interferences lead to a periodic signal having a
l/2n period versus time
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Laser Endpoint Detection
Al reflects the laser, there is no interference
effect.
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Recap of Corial 300 Features

• New RIE reactor to achieve highly uniform
  delayering for ?300 mm wafer yield analysis,
• Wide process range from isotropic to anisotropic,
• Clean etching,
• Low metal erosion (low damage).