UCSB Testing Status

1
UCSB Testing Status
Anthony Affolder (for the UCSB module testing
group)

• Current testing infrastructure
• Test results
• Module test equipment needs
• Software Needs
• Current testing through-put

2
Testing Facilities Readiness

• Clean room adjacent to production area
• Room layout finished
• Currently in high bay with intentionally same
  layout
• Missing only hybrid thermal cycling test
• Clean room will be finished in April
• Storage cabinet with dry air flow in place for
  testing phase
• Long term module storage cabinets under
  construction at KSU

3
UCSB Recent Infrastructure Projects

• Hybrid holding plates
• Matches hybrid thermal cycling test stand
• Can bond and test with low noise in same holder
• Burn-in low voltage distribution crate
• LED indicators and fuse protection
• Crowbar
• HV protection circuit
• 12 each for FNAL/UCSB
• Module cold plate
• Attaches to current module holder
• Hybrid clamshell
• Module clamshell

4
Hybrid Visual Inspection

• Once FNAL indicated lift off problem, closely
  visually inspected our 5 hybrids
• Found 1 wire bond lift off
• Bonds have redundancy so no failure seen
• Removed broken bond to eliminate chance of short
• Will closely monitor for lift off/ wire breaks
  throughout production process

5
Current UCSB ARC Setup

• 3 ARC Controller 5 new ARC FE 1 old ARC FE
• 1 Hybrid testing (2 Hybrid
  clamshells)
• 2 Module testing (Module clamshell)
• 2 LED systems
• DEPP HV supply
• Missing hybrid-to-utri adapters to fully use
  capacity

Hybrid Clamshell
ARC crate
DEPP
ARC Controller
Module Clamshell
LED Controller
6
ARC Hybrid Test Results (1)

• 5 hybrids tested on arrival
• All good, but fail current requirement given in
  the Procedures for Module Testing
• Pedestal test reproducible, but noise measured
  very sensitive to digitization effects
• Measured noise varying the pedestal by changing
  VPSP value
• Digitization effects cause variations larger than
  20
• Hybrid noise requirements should be changed
• Ni within 50 of average
• 0.3 lt Ni lt 1.5
• Removes chance of chips with uniformly low/high
  noise from passing requirements
• See hep.ucsb.edu/cms/cmsUCSB.html for more
  complete description

7
ARC Hybrid Test Results (2)

• 4 hybrids have had APV bonded to pitch adapters
• All channels are good
• Hybrid clamshells enable testing without large
  pickup effects at chip edges
• Hybrid isolated with base plate and lid grounded
• Same requirements can be made for hybrids with or
  w/o PA bonded

8
ARC Gain Measurements (1)

• Multi-point gain added to ARCS 6.0 beta software
• Thanks to the Aachen group
• Tests are very quick and have advantages over
  pulse shape measurements
• More uniform
• More stable
• Gain linearities
• Gain variations
• Strongly suggest that test be added to all M800
  production. Will be included TOB testing
• Make requirements on gain slope, offset and fit
  c2

9
ARC Gain Measurements (2)

• 2 of 24 chips so far have no response with low
  injection values
• Only occurs in peak mode inverter on
• Caused by initialization defaults in ARCS tests
• VPSP set too low
• Thanks to T. Franke and M. Raymond for help
• VPSP setting will be modified in new release
• Removes all seen irregularities

10
ARC Module Test Results (1)

• 1 Prototype Module Tested
• 1 Production Module Tested
• Module testing in UCSB clamshell decreases
  common-mode noise to the point where location of
  opens become detectable by their noise levels
• PA-sensor
• Sensor-sensor
• Pinholes act as if saturated
• High current channels can have higher noise (Bad
  IStrip
• Slight noise increase on chip edges
• Two neighboring channels have high noise only in
  peak inverter on

PEAK ON
Unknown Problem
Bad CAC
Bad Istrip
Sensor-sensor open
PA-sensor open
Pinhole
11
ARC Module Test Results (2)
PEAK ON

• LED pinhole test
• Bonded one inherent pinhole on purpose
• Test acted as expected
• 120 mA needed to unsaturate pre-amp
• Not clear if maximum current (400 mA) supplied
  sufficient to find high current pinholes

Pinhole
Unknown Problem
PA-sensor open
Sensor-sensor open
12
ARC Module Test Results (3)
PEAK ON
Pinhole
PA-sensor open
Unknown Problem
Bad CAC
Bad Istrip
Sensor-sensor open

• Gain test
• Pinhole clear by lack of gain
• Opens clear by higher gain

13
ARC Test X-calibrations

• Minimal X-calibration has been performed
• Same faulty channels found at FNAL/UCSB on
  prototype model
• CERN FHIT/UCSB ARC test compared
• Pedestals very similar
• Noise is slightly higher than CERN FHIT
  measurement
• Not understood if it is FHIT/ARC difference, a
  software difference, an environmental difference,
  or a digitization effect
• Once model production begins, plan to exchange
  modules with FNAL for X-calibration

14
ARCS Database

• No entries yet put into official database
• Waiting for ARCS interface for database upload
  and database definition to stablize
• All testing results have been made available to
  silicon community on local website
• hep.ucsb.edu/people/affolder/module_test_UCSB.html
  

15
DAQ status

• 1 full DAQ stand available at UCSB
• Planned only for Vienna box tests with modules
• Limited number of tests performed
• See P. Gartungs talk
• Focus on bringing up hardware/software for Vienna
  box
• Xdaq, LT, and Xrod software all compiled and run
• Still working to understand controls/output
• No LED stand planned for DAQ
• No database work done as of yet

16
Vienna Box Status

• Vienna Box recently arrived at UCSB
• No modification necessary to use with TOB module
  carrier plates
• Full compliment of plates currently in machine
  shop
• LV distribution ready
• Just received HV controllers (both the A128HS and
  A1303)
• Integrating as fast as possible
• Demonstrated each slot works with hybrids
• Thermal cycled box between 25 to 30 C with
  chiller
• Need hardware to test more than one channel at a
  time
• See P. Gartungs talk for more details

17
Current Hardware Needs

• ARC Needs
• 1 DEPP
• 1 LED system
• Will be picked up this week
• Torino Interlock Box
• In-route
• 3 Electrometers
• 2 in-route
• Flat cable-Lemo adapter
• Under construction at UCSB
• 13 hybrid-to-utri ver. D
• 1 in-route
• Used for both ARC module and burn-in test
• Limiting factor in testing through-put

• Hybrid thermal cycling box
• Lack hardware/software
• Tests will be performed by A. Honmas group for
  M800
• We are aiding in the manufacturing of test stand
• DAQ components
• 8 VUTRI
• 10 in-route
• 9 PAACB
• 6 in-route
• 1 TPO
• 1 in-route
• 1 CCU
• 1 in-route
• 2 PAACB to TPO interface
• Needed for backplane pulsing

18
Current Testing Software Needs

• Hybrid Characterization
• Database input
• Module Testing
• IV scan, backplane pulsing test, database input
• Module Burn-in
• Rods
• Beginning to assemble necessary infrastructure
  for rod assembly/ burn-in
• Xrod and LT software package already compiled and
  running

19
Current Estimated Testing Through-put

• Hybrid Arrival Testing
• 24 hybrids per day
• Matches peak production ( contingency)
• Requires dedicated tech
• Module Basic Test
• 2 ARC LED stands but only 1 hybrid-to-utri
  version D
• 12 modules per day
• Requires dedicated tech

• Module Burn-in (Vienna Box)
• See P. Gartungs talk for details
• Lack of hybrid-to-utri adapters limits testing
  through-put to 1
• While burn-in test underway, no module testing
  possible
• Module characterization test will be done at
  beginning/end of test cycles
• ARC After Burn-in Test
• Not clear how much ARC testing necessary after
  burn-in
• Depends on grounding/pickup issues
• LED is minimal test

Time estimates do not include database
entry. After finishing test equipment
acquisition/integration, database will be first
priority.