Folie 1

1
Smaller systems

• Small form factor MicroTCA
• Less rack space
• Scalability
• Lower initial investment

1U High MicroSlim Chassis
2
Cooling smaller systems

• Side-to-side airflow configuration requires proof
  of cooling performance
• Powerful redundant Cooling Units (CUs)
• Thorough simulation/testing
• 96 CFM _at_ .75 water
• Cools 36W/module

3
Prototyping/Testing

• Prototyping/Testing is now easier
• Testing tools now available (Extender, Load
  Board, Air Baffle)
• Cost-effective testing tools
• Wide range of test enclosures
• Signal Test Module available soon (Summer 2008)

AMC Extender Board
AMC Load Board
AMC Signal Test Module
AMC Air Baffle/Deflector
4
Rugged MicroTCA

• Rugged MicroTCA
• Specifications still in process
• More bandwidth than most other open architectures
• Various levels of ruggedization
• Good balance of cost/performance
• Elma's team is authoring the MicroTCA.1 Sections
  5 (Thermals) and 10 (Test Setup) for the Rugged
  MicroTCA specification. 
•  

5
Rugged MicroTCA Specifications
MicroTCA.1 (Draft) MicroTCA.2 (started)
(MicroTCA.x) Forced Air Cooled
Conduction Cooled Conduction
Cooled Modules Modules
non-liquid Modules-liquid Industrial based
MIL based MIL
based
?
General Industrial centric (includes telco MIL)
MIL centric
6
Rugged MicroTCA RD

• Modularity can be incorporated
• Flexibility
• Less customization costs
• Also
• Clamping down modules to panels
• Re-use of rugged design concepts
• Testing confirms it passes MIL-STD-810E for
  shock/vibration and MIL-STD-461 for EMC