PowerPoint

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Lead-free Roadmap 2002Roadmap 2002 for
Commercialization of Lead-free Solderofficial
version 2.1September 2002Lead-Free Soldering
Roadmap CommitteeTechnical Standardization
Committee on Electronics Assembly Technology
JEITAJapan Electronics and Information
Technology Industries Association

Suga, The University of Tokyo
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Policy in making the Lead-free Roadmap 2002

• Make the clear definition of lead-free.
• Put the trends of lead-free application on a
  timeline.
  
• Clearly show the leading makers and the
  followers.
  
• Make the de facto standard.
• Extract and promote the standardization, without
  picking up every factor.
  
• Make active proposals towards the rest of the
  world.
  
• Based on questionnaire survey.
• February 2002, 160 answers

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Roadmap 20021. Definition of Lead-free Lead
content

• Definition of lead-free In the following phases,
  the amount of contained Pb in the prescribed
  parts planned for lead-free adoption should be
  less than 0.1w percent.
• The value must be given if it exceeds that
  amount.
  
• If there is any exemption, the definition refers
  to the rest parts of the product, with indication
  of the name of the item of the exemption and the
  amount of contained Pb.

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Roadmap 20021. Definition of Lead-free
Lead-free phase
Components
Equipment
Phase 1
Common definition in the equipment for
lead-freeNo leaded solder is used at the stage
of board assembly in board surface finishing,
solder paste and solder bath,
Components withstand heat resistance
Heat resistance against soldering in assembly
with lead-free solder
Phase 1
Phase 1A
Equipment with lead-free solder
A Application of current components or
components withstand heat resistant, Phase1
(Composing components and materials may contain
lead, while the assembly solder is lead-free)
Components with lead-free solder
Module components etc. Correspond to Phase1 in
Equipment.
Phase 2
Phase 2
Lead-free terminal components No lead contained
plating and electrodes of terminal parts of
components assembled to PWB etc. The components
may contain leaded composing components and
materials.
Equipment with lead-free solder
BApplication of lead-free terminal components,
Phase2, or lead-free components, Phase3 (Even if
the assembled components are lead-free, the other
components and materials may contain lead.)
Phase 3
Phase 3
Lead-free components No lead
contained in all the internal bonding and/or
composing components and materials
Lead-free equipment Application
of lead-free components, Phase3, only and non
leaded composing components and materials in
addition to assembled components and bonding
materials
Phase 0
Lead-free component equipment
Application of lead-free terminal components,
Phase2, or lead-free components, Phase3, with
lead-bearing solder in bonding materials
(Excluded from the category of lead-free
equipment)
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Roadmap 20022. EU-regulation and Japanese
reaction

• The lead-free regulation in the EU will be
  accepted with reluctance in Japan, if it is
  crucial for the environment.
  
• In that case, the same kind of regulation should
  be required also in Japan.
  
• A global agreement on the definition of lead-free
  and on the standard for judgment is needed as
  early as possible.

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Roadmap 20023. Timeline for lead-free

• Timeline for lead-free Set up the schedule for
  the average makers as follows.
  
• Components
• Start supplying components withstand heat
  resistance / lead-free terminal components
  ---------------------------------------------2001
  
• Complete supplying of lead-free terminal
  components --2003
  
• Complete supplying of lead-free components
  --------------2004
  
• Equipment
• Start introducing lead-free solder
  ------------------------------2002-2003
  
• Totally adopt lead-free solder into new products
  -----------2003
  
• Complete lead-free adoption ---------------------
  ---------------2005
  
• The leading makers are 1 year ahead of this
  schedule, and the followers are 2 years behind.
  
  
• There is a need to establish a worldwide
  milestone and a roadmap.

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Roadmap 20026. Standardization of lead-free
solder

• The following types of solder are recommended.
• Board assembly(Recommended) Sn-3Ag-0.5Cu
• Reflow Sn-3Ag-0.5Cu Sn-Ag Sn-Zn-Bi
• Wave Sn-3Ag-0.5Cu Sn-Cu
• Hand Sn-3Ag-0.5Cu
• Components
• Solder balls (Recommended) Sn-3Ag-0.5Cu
• Land finish (Recommenced) Plating/Au, Solder
  precoat/Sn-3Ag-0.5Cu
  
• Currently, more than one type are adopted to
  component electrodes and terminal plating as
  follows.
  
• Component electrodes and terminal plating
  (Current situation)
  
• Semiconductor components Sn-Bi plating is
  majority Sn-Bi Sn-Cu Sn Sn-Ag Au-Pd
  
• Passive components Sn plating is the main Sn
  Sn-Cu Sn-Bi
  
• Terminal finishes Sn-Cu plating and Sn plating
  are the majorities Sn-Cu Sn Au

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Roadmap 20027. Assessment standard for heat
resistance of components wave soldering

• For the time being, the heat resistance standard
  for wave soldering is
  
• 260?C, 10 seconds.

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Roadmap 20027. Assessment standard for heat
resistance of components reflow soldering

• As for the temperature profile for heat
  resistance assessment in reflow, the equipment
  makers are likely to assume the Hat type and
  the component makers are likely to assume the
  Angle type. The Hat type is a recommendation.

Hat type
30?40s
Angle type


260
240?250
220?230
220
90s
30?60s
180/180
150/ 150
90?120s
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Roadmap 20028. Facilities, processes, and design
change

• Promote lead-free adoption and energy saving by
  improving facilities and processes without large
  changes in design.

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Roadmap 20029. Labeling

• Promote industrial standardization of lead-free
  labeling.

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Outline

• Survey (2004.Sep)
• A survey has been conducted to confirm the
  progress on lead-free implementation and
  associated problems.
  
• Respondents of Survey
• Results of Survey
• Assembly Manufacturers
• Device Suppliers
• Material Suppliers

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Respondents of Survey
Total number of manufacturers and suppliers who
responded the survey 92
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Results of Survey
?

• Assembly Manufacturers
• Device Suppliers
• Material Suppliers

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Results of Survey Assembly manufacturers
Q 1. Is lead-free assembly manufacturing in
progress?
White goods, AV information appliances, PDA,
Printer, Copier 14
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Results of Survey Assembly manufacturers (Contd)
Q 1. Is lead-free assembly manufacturing in
progress?
Exchanger at base transceiver station, Industrial
control equipment, Vehicle equipment, Others 10
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Results of Survey Assembly manufacturers (Contd)
Q 2. What are problems with lead-free
implementation?
White goods, AV information appliances, PDA,
Printer, Copier 14
Exchanger at base transceiver station, Industrial
control equipment, Vehicle equipment, Others 10
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Results of Survey Assembly manufacturers (Contd)
Q 3. How much should be the allowable lead
content in solder?
White goods, AV information appliances, PDA,
Printer, Copier 14
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Results of Survey Assembly manufacturers (Contd)
Q 3. How much should be the allowable lead
content in solder?
Exchanger at base transceiver station, Industrial
control equipment, Vehicle equipment, Others 10
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Results of Survey Assembly manufacturers (Contd)
Q 4. Is lead-free implementation of terminals in
progress?
White goods, AV information appliances, PDA,
Printer, Copier 14
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Results of Survey Assembly manufacturers (Contd)
Q 4. Is lead-free implementation of terminals in
progress?
Exchanger at base transceiver station, Industrial
control equipment, Vehicle equipment, Others 10
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Results of Survey

• Assembly Manufacturers
• Device Suppliers
• Material Suppliers

?
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Results of Survey Device suppliers
Q 4. Is lead-free implementation of terminals in
progress?
Semiconductor devices 10
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Results of Survey Device suppliers (Contd)
Q 4. Is lead-free implementation of terminals in
progress?
Passive components 23
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Results of Survey Device suppliers (Contd)
Q 4. Is lead-free implementation of terminals in
progress?
Connecting devices 17
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Results of Survey Device suppliers (Contd)
Q 4. Is lead-free implementation of terminals in
progress?
Transducers, Modules, and Others 9
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Results of Survey Device suppliers (Contd)
Q 2. What are problems with lead-free
implementation?
Passive components 23
Especially vehicle manufacturers do not want to
use Sn-Bi plated devices. Certain markets and ma
nufacturers that do not need to comply with RoHS,
ELV, WEEE directives want lead-containing plated
devices. That makes us difficult to consolidate
all the plating into lead-free.
It takes much time to get approval for lead-free
devices used for medical equipment.
We cannot supply lead-free devices to some
manufacturers due to the lack of appropriate
mounting technologies and management methods at
their ends. Sn-Cu and Cu/Sn plated terminal leads
are not accepted by assembly manufacturers.
The thickness of Ni plated SMD cannot meet that
specified by certain assembly manufacturers.
Some assembly manufacturers havent decided
whether to incorporate lead-free devices into
their business. Even if some of them may have
already decided to use lead-free devices, they
need to take plenty of time to approve them
before use. Lead-free implementation varies by a
ssembly manufacturer, and therefore we cannot
consolidate all the plating into lead-free.
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Results of Survey

• Assembly Manufacturers
• Device Suppliers
• Material Suppliers

?
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Results of Survey Material suppliers
Q 6. How much percentage do solder suppliers sell
lead-free solder?
Solder suppliers 5
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Results of Survey Material suppliers (Contd)
Q 3. How much should be the allowable lead
content in solder?
Solder suppliers 5
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JEITA 2004
Emergency Project to AccomplishLead-free
Soldering (Plan)
July 1, 2004
Lead-free Soldering Roadmap Committee
JEITA Emergency Project Members
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Lead-free Soldering Roadmap Collaboration of
Equipment Parts
3. Milestone of lead-free soldering Set the
below schedule for average manufacturers
Parts Supply of lead-free
parts/terminals started End of 2001
Assortment of lead-free terminals
completed End of 2003 Assortment of lead
-free parts to be completed End of 2004
Equipment Introduction of lead-free solder
started 20022003 100 lead-free to be comple
ted End of 2006 (assuming EU-RoHS-2007)
Parts Supply of lead-free parts / terminal
parts started End of 2001 Assortment of lead
-free terminals completed End of 2003
Whisker (on connectors) occurred, etc.
Assortment of lead-free parts to be
completed End of 2004 Equipment Introducti
on of lead-free solder started 20022003
Low-temperature solder
Erosion of solder bath Solder joint
of 0.1 Pb, etc. 100 lead-free to be complet
ed End of 2006 (assuming EU-RoHS-2007)
Immediatemeasuresare vital
Can these goals be attained all across Japan by
May 2005?!
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Emergency Suggestions!!
Purpose
? To clarify immediate measures against important
issues Must be accomplished by December 2004
Important Issues and Immediate Measures
? Erosion of solder bath ? Cast bath, stati
c bath, etc. ? Countermeasure against whiskers
? SnBi plating alternative to Au plating,
etc. ? Low-temperature solder ? Aiming at
190C Zn/Bi/In solder, etc. ? Solder joint havin
g 0.1 Pb content ? High-precision Pb det
ector, 100 Pb-free plating, etc.