TRD Electronics

1
TRAP3 chip production
Volker Lindenstruth Chair of Computer Science
Kirchhoff Institute for PhysicsUniversity
Heidelberg, Germany Phone [phone]
9800 Fax [phone] Email ti_at_kip.uni-heide
lberg.de WWW www.ti.uni-hd.de
2
Wafer 4 Wafer 10
3
Wafer 4 Wafer 10
4
Wafer 4 Wafer 10
5
Dirt on Wafer
6
Test according to AEC - Q 100-Rev. F

• Comercial
• 0C - 70C with linear temperature gradient
• 3 - 5K/Min. rise ad fall
• Hold time at end temp 15 min
• 10 cycles
• For stress test of MCM modules use
• Industrial
• -40C - 85C with linear temperature gradient
• 3 - 5K/Min. rise ad fall
• Hold time at end temp 15 min
• 25 cycles
• Xray same part of DIE before and after test
• Verify before / after stress test
• Ideally verify bonding pull strength